Electronics Forum | Tue Jun 26 15:40:12 EDT 2012 | ssupertuba
Hello there, I'm presently experiencing some blow holes and solder voids in the solder fillet of caps on boards. They are ceramic caps. The solder is SAC105 and the parts range from 33pf to 0.1uf ceramic. Any suggestions?
Electronics Forum | Thu Jul 26 17:43:57 EDT 2007 | tphan
Board had a via hole underneath of the solder pad of the BGA. When it run through reflow oven, it caused a lot of void. How to correct this issue?
Industry News | 2021-01-06 17:17:19.0
The SMTA Capital Chapter is excited to host the first chapter webinar of 2021 on January20that11:00 AM EST.Fred Dimock, BTU International, will be presenting "Operation of a Vacuum Reflow Oven with Updated Void Reduction Data."
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
& Technical Articles Videos THERMAL PROCESS SOLUTIONS Reflow Soldering Solutions Causes & Defects – Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids Intermetallic Growth on PCB
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Submit works, Reflow oven,SMT Reflow Soldering Oven has the right to reprint or referenced in the web site You agree that you accept up words if you leaved your words on the Message Board Circuit Board Voids
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