Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Industry News | 2012-03-28 17:53:21.0
IPC announces the appointment of John W. Mitchell as its new president and CEO,
Industry News | 2012-11-07 11:01:55.0
IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2024-02-12 13:44:30.0
In a letter signed by 54 microelectronics executives, IPC and Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund the Defense Production Act Purchases Account at the House-passed level of $618 million and $1.08 billion for the Industrial Base Analysis and Sustainment program.
Industry News | 2023-06-26 09:24:19.0
Content provides an in-depth look at the shift in today's hiring practices
Industry News | 2023-03-27 13:12:28.0
The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S. President Joe Biden and Canadian Prime Minister Justin Trudeau:
Industry News | 2019-08-08 22:35:07.0
The SMTA is pleased to announce three inspiring keynote presentations scheduled during SMTA International 2019. Adam Steltzner, Ph.D., NASA, will keynote SMTA International the morning of Tuesday, September 24 with his presentation “The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation.” Adam will share the challenges he faced leading the landing team for NASA’s Curiosity Rover on its mission to Mars. The lessons learned from those struggles illustrate how to better lead high performing teams, manage innovation and drive towards excellence.
Industry News | 2023-06-07 19:53:22.0
On May 17, 2023, IPC and Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) signed a Memorandum of Understanding (MoU) at the Electrical Wire Processing Technology Expo (EWPTE) in Milwaukee, Wis., USA. The MoU aims to promote the adoption and use of IPC-2591, Connected Factory Exchange, the plug-and-play industry standard for factory communication which sets the baseline for companies to achieve Industry 4.0.
Industry News | 2012-05-15 10:31:04.0
IPC Midwest will highlight the new technologies, materials and processes in electronics manufacturing to help engineers solve their challenges and work smarter.
