New SMT Equipment: wafer in (1)

Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 ​​​ yuehang:  Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply: New+original+factory sealed+high quality

Electronics Forum: wafer in (3)

Voids in solder bumps

Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan

Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action

Re: solder paste in Flipchip

Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett

You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa

Industry News: wafer in (95)

Nordson Advanced Technology Systems Expands to New Facilities in Taiwan

Industry News | 2013-12-23 12:13:41.0

Nordson Corporation announces that its Advanced Technology Systems operation in Taiwan has moved to a new facility that doubles its footprint and will encompass enhanced engineering, applications, sales, service, and support for its electronics manufacturing customers.

Nordson ASYMTEK

> FREE Registration for June 12-13, held in The Netherlands

Industry News | 2013-05-01 12:45:51.0

Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht

Nordson ASYMTEK

Technical Library: wafer in (10)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Challenges in Bare Die Mounting

Technical Library | 2014-05-08 16:34:16.0

Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.

Die Products Consortium

Videos: wafer in (1)

TORCH reflow oven

Videos

Covering the industrial chain of power semiconductor materials, chips, modules, equipment and other industries, dozens of enterprises from home and abroad participated in the exhibition. This series of products can control the welding cavity rate of

Beijing Technology Company

Events Calendar: wafer in (1)

Chapter Technical Meeting: Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability

Events Calendar | Tue Feb 25 00:00:00 EST 2020 - Tue Feb 25 00:00:00 EST 2020 | Boxborough, Massachusetts USA

Chapter Technical Meeting: Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability

International Microelectronics Assembly and Packaging Society (IMAPS)

Express Newsletter: wafer in (64)

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University

Partner Websites: wafer in (3854)

Wafer Inspection and Metrology

Nordson ASYMTEK | https://www.nordson.com/en/divisions/dage/wafer-inspection-and-metrology

range of inline and lab based X-ray inspection and metrology solutions for assessing and monitoring wafer level quality. Check shape, fill level and voiding in TSV through silicon vias

Nordson ASYMTEK

ASM MS899 Wafer Mapping Die Sorter MS899-DL

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asm_MS899.html

ASM MS899 Wafer Mapping Die Sorter MS899-DL   ASM MS899-DL Wafer Mapping Die Sorter Machine is in good condition! Serial Number: MS899DL-01817-0402 Model Number

1st Place Machinery Inc.


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