Technical Library: waffle tray strap (Page 1 of 1)

Component Shortages Causing Electronics Manufacturers to "Use All Means Necessary" to Ship Products

Technical Library | 2010-11-24 20:47:38.0

As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap

BEST Inc.

Dummy Components Part Numbering System

Technical Library | 2000-11-13 20:45:03.0

Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips.

TopLine Dummy Components

Solder Preform Basics

Technical Library | 2009-12-14 20:27:54.0

Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering.

Indium Corporation

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

Technical Library | 2011-08-04 19:29:53.0

This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and

Auburn University

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