Industry News | 2013-06-20 19:12:14.0
Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
Industry News | 2013-01-12 12:27:34.0
With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons. That way, users can process on their SMT line even extremely large components with snap-in or through-the-hole fasteners such as connector modules for automotive or IT applications.
Industry News | 2009-11-01 18:10:15.0
The SIPLACE Team is so confident in its new affordable SIPLACE SX concept of "Real Capacity on Demand" that they have taken to the road in the Americas to spread the word. The SIPLACE team is performing live gantry upgrade demonstrations at record breaking speeds. The team is revealing how quickly and easily you can add placement performance to a line without influencing feeder capacity or line length; how easily placement capacity can be moved from one line to another; and how easily feeder capacity can be added without the cost of adding an entire new machine.