Industry News | 2020-08-22 04:07:55.0
Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Industry News | 2013-01-12 12:27:34.0
With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons. That way, users can process on their SMT line even extremely large components with snap-in or through-the-hole fasteners such as connector modules for automotive or IT applications.
Industry News | 2014-09-09 12:33:50.0
– Panasonic Factory Solutions Company of America introduces the NPM-D3 to the award-winning, multi-functional NPM-series SMT platform. In addition to its interchangeable, plug-and-play placement heads, the NPM-D3 integrates solder paste inspection (SPI), adhesive dispense (ADH), and post-placement inspection (AOI).
Industry News | 2021-07-22 15:00:19.0
Technology leader ASM will present its latest innovations for the electronics manufacturing industry in a livestream on September 1, 2021. "ASM Impact – Release Summer 2021" will focus mostly on process improvements across the whole spectrum ranging from printing, inspection and placement to fully integrated software solutions. Examples include enhancement for DEK TQ and DEK NeoHorizon solder paste printers as well as for the AMS ProcessLens SPI system, along with new, smart SIPLACE feeder solutions. The event will also feature new functions and enhancements for the ASM Works smart factory suite. Another highlight will be the extensive capabilities of the ASM Factory Equipment Center solution for company-wide and non-proprietary asset and maintenance management. For more details about the event and to register, visit https://asm-smt-events.com/.
Industry News | 2013-03-12 13:42:20.0
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.
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