New Equipment | Test Equipment
MALCOM SP-2 WETTING TESTER The Malcom SP-2 Wetting Tester simulates either reflow conditions (for solder paste), or wave soldering conditions (for molten solder) for the measurement of wetting force for your components. MALCOM SWB-2 AUTOMATIC WETTI
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac
Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a
Industry News | 2012-11-02 09:04:14.0
IPC and SMTA jointly announce the agenda for Session 5 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2009-02-03 13:34:04.0
New PCB Rework, Repair, Fabrication Training & Consulting Services.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
ALPHA® Preforms with solder paste adds solder volume.
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
: Communicating With Impact and Developing Your Authentic Presence Jun 24, 2020 Webinar: Europe Chapter: Solder Preform World - Not New Technology but a Very Interesting Option Webinar Jun 25, 2020 Webinar
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_wave-soldering-sot23_topic995.xml
. The standard says that the same footprint pattern can be used for reflow, infrared, vapor phase, full wave and selective wave solder processes.
