Industry News | 2003-06-09 09:16:38.0
The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2014-09-29 16:02:30.0
IPC’s Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Hunter Technology Corp., an electronics design and manufacturing services firm based in Milpitas, Calif.
Industry News | 2017-10-12 15:05:21.0
KIC is pleased to announce the release of its new Vantage network software system. The new software provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device. The process data is automatically stored in a central location where the engineer can quickly retrieve and share all relevant data.
Industry News | 2019-09-15 16:55:59.0
KIC will exhibit in Booth #1218 at SMTA International, scheduled to take place Sept. 24-25, 2019 at the Stephens Convention Center in Rosemont, IL. The KIC team will discuss Industry 4.0 automation, traceability, NPI setup, machine verification, and more, all for your thermal processes; reflow, wave solder and cure.
Industry News | 2019-10-16 14:39:56.0
KIC announced that it will exhibit in Hall A4, Booth 506 at Productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. The KIC Europe team will discuss Industry 4.0 automation, traceability, NPI setup, machine verification, and more, all for your thermal processes; reflow, wave solder and cure. RPI i4.0. is a simple solution and a great way to start your Industry 4.0 journey, changing heat to data on your reflow oven.
Industry News | 2017-10-31 18:46:42.0
At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
Industry News | 2023-04-11 09:54:13.0
KIC will exhibit in Hall 4, Booth #126 at SMTconnect, scheduled to take May 9-11, 2023, in Nuremburg, German. KIC provides the most accurate Heat to Data™ solutions including its award-winning support with onsite service and application knowledge from the thermal process experts.
Industry News | 2009-10-16 20:47:17.0
Stylish aluminum carrying case opens to reveal a 10,000 cph counter of surface mount devices that is easily carried, ideal for off-premises inventory taking and incoming/outgoing parts count verification.
Industry News | 2019-01-03 15:42:23.0
Clearwater, FL – Solderstar will launch its new Smartline-X thermal profile management system at the IPC Apex Expo, to be held in San Diego between the 29th and 31st of January 2019. Smartline-X is a web-powered platform that automates thermal profile verification across an organization’s manufacturing sites. Data can be received from reflow ovens, wave/selective soldering machines and the vapor phase process using Solderstar’s comprehensive range of profile measurement devices and the Smartline-X system.
