New SMT Equipment: wedge and bond (Page 1 of 6)

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

New Equipment | Inspection

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Epoxy and Adhesive

Epoxy and Adhesive

New Equipment | Dispensing

For Die attach / Die bonding / Potting / Casting / Encapsulating / etc.

K-Net International Ltd.,Part

Reflow Soldering and Bonding Heads

New Equipment |  

This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.

Unitek Equipment

Track, Trace and Control Solutions

Track, Trace and Control Solutions

New Equipment | Inspection

Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan

Microscan

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

PHM Hot Bar Soldering and Bonding Machines

PHM Hot Bar Soldering and Bonding Machines

New Equipment | IC Packaging

Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis

Fancort Industries, Inc.

C-Prime - Bonding and Soldering Desktop System

C-Prime - Bonding and Soldering Desktop System

New Equipment | Soldering Robots

C-Prime Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm. The Nordson DIMA Desktop Series is a product range for ACF

Nordson DIMA

C-Slide - Bonding and Soldering Desktop System

C-Slide - Bonding and Soldering Desktop System

New Equipment | Soldering Robots

C-Slide Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with a fixture size up to 250 x 250 mm. The Nordson DIMA Desk

Nordson DIMA

C-Turn - Bonding and Soldering Desktop System

C-Turn - Bonding and Soldering Desktop System

New Equipment | Soldering Robots

C-Turn Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up to 160 x 160 mm. The Nordson DIMA Desktop Series is a p

Nordson DIMA

C-Base - Bonding and Soldering Desktop System

C-Base - Bonding and Soldering Desktop System

New Equipment | Soldering Robots

The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring a

Nordson DIMA

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High Speed Precision In-Line SPI System - Mirtec MS-11


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