Industry Directory: wedge bond (4)

Chengdu Yeheng Electronics Co.,Ltd

Industry Directory | Manufacturer of Assembly Material / Other / Assembly / Component Packaging / OEM

More than 17 years manuafacture experience in designing,producing of wire bonding tools- wire guide,cutter,wedge,clamp finger,and OEM seivice available.ISO 9001approved and CE SGS certificated.Selfowned patent.

Kulicke & Soffa Pte. Ltd.

Industry Directory | Manufacturer of Assembly Equipment / Assembly / Pick and Place

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments.

New SMT Equipment: wedge bond (39)

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

New Equipment | Inspection

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Wedge

Wedge

New Equipment | Other

For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge

K-Net International Ltd.,Part

Electronics Forum: wedge bond (17)

COB and wire bond

Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas

Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you

COB and wire bond

Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh

Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,

Used SMT Equipment: wedge bond (2)

Kulicke&Soffa Industries K&S 4124 Wedge Bonder

Kulicke&Soffa Industries K&S 4124 Wedge Bonder

Used SMT Equipment | Semiconductor & Solar

Becoming available soon; K&S 4124 Wire Bonding Machine currently in production to be removed in complete working condition. Contact: Assured Technical Service LLC Minneapolis, MN 55441 AssuredTechnicalServiceLLC@Gmail.com FOB Origin. The

Assured Technical Service LLC

ASM AB530, DS500, AD896

Used SMT Equipment | SMT Equipment

ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com

Customer Satisfaction Technology Company

Industry News: wedge bond (21)

IPC Announces Winter 2012 Webinar Schedule

Industry News | 2011-12-21 22:41:39.0

Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.

Association Connecting Electronics Industries (IPC)

Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting

Industry News | 2012-05-30 13:50:20.0

Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.

Hesse Mechatronics

Technical Library: wedge bond (2)

Wedge Bonding Tool Selection

Technical Library | 2019-05-23 10:30:22.0

Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.

ACI Technologies, Inc.

Copper Wire Bond Failure Mechanisms.

Technical Library | 2014-07-24 16:26:34.0

Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.

DfR Solutions

Videos: wedge bond (2)

Viscom AOI

Viscom AOI

Videos

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

STI Capabilities

STI Capabilities

Videos

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

Events Calendar: wedge bond (1)

Electronics Packaging Technology Conference - EPTC 2015

Events Calendar | Wed Dec 02 14:00:00 EST 2015 - Fri Dec 04 14:00:00 EST 2015 | Austin, Singapore

Electronics Packaging Technology Conference - EPTC 2015

Institute of Electrical and Electronics Engineers (IEEE)

Career Center - Resumes: wedge bond (1)

Equipment Maintenance Technician

Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support

                                                 Duties & Responsibilities (Equipment Technician):  Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment.  Conduct Preventive maintenance

Express Newsletter: wedge bond (113)

SMTnet Express - July 24, 2014

SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either

Partner Websites: wedge bond (557)

ACI Technologies, Inc

ACI Technologies, Inc. | https://www.aciusa.org/wp-content/uploads/2021/07/techtip2-2018.pdf

ØH = Hole Diameter H = Wire Feed Angle (30° through 90°) BF = Bond Foot Length BL = Bond Length VR = Vertical Relief T = Total Length of the Wedge The bond length is calculated using the formula: BL = 2/3FR + BF

ACI Technologies, Inc.

N2 Imaging Systems - Day 2

| http://www.thebranfordgroup.com/dnn3/Employees/OnlineAuctionAdmin/N2ImagingSystems-Day2/tabid/1869/AuctionID/1599/Default.aspx?page=2

; No Contents Category: 2058 Royce Model 650 Universal Bond Tester, S/N 1005050, w/ Wire Pull, m/n SMW-100G-21845, Leica Microscope and Computer, (2011


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