High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge
New Equipment | Assembly Services
Suitable for wire bonder OEM service available.Factory price. Contact: yoyogong@yehengdz.com
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.
For Wire Bonding (Heavy Wire Wedge Bonding)
For Wire Bonding (Wedge and Ball Bonding)
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
New Equipment | Assembly Services
Suitable for OE 7200HD,7600HD,7200 Plus machine. Specification: 5/6/8/10/12/15/16/18/20 mil OEM service available.Factory price. Contact: yoyogong@yehengdz.com
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
