Industry Directory: wedge-bond (2)

Kulicke & Soffa Pte. Ltd.

Industry Directory | Manufacturer of Assembly Equipment / Assembly / Pick and Place

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments.

Chengdu Yeheng Electronics Co.,Ltd

Industry Directory | Manufacturer of Assembly Material / Other / Assembly / Component Packaging / OEM

More than 17 years manuafacture experience in designing,producing of wire bonding tools- wire guide,cutter,wedge,clamp finger,and OEM seivice available.ISO 9001approved and CE SGS certificated.Selfowned patent.

New SMT Equipment: wedge-bond (6)

Clamp Finger/Anil Wedge Bonding Tool

Clamp Finger/Anil Wedge Bonding Tool

New Equipment | Assembly Services

Suitable for wire bonder OEM service available.Factory price. Contact: yoyogong@yehengdz.com

Chengdu Yeheng Electronics Co.,Ltd

Wedge

Wedge

New Equipment | Other

For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge

K-Net International Ltd.,Part

Electronics Forum: wedge-bond (9)

wirebonding

Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef

Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin

wirebonding

Electronics Forum | Sun Sep 04 23:42:31 EDT 2005 | juan2208

hi all, i have a question about the wirebonding That is under what circumstances that the ball bonding is used and under what circumstaces the wedge bonding is used? thanx advanced.

Industry News: wedge-bond (13)

IPC Announces Winter 2012 Webinar Schedule

Industry News | 2011-12-21 22:41:39.0

Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.

Association Connecting Electronics Industries (IPC)

Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting

Industry News | 2012-05-30 13:50:20.0

Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.

Hesse Mechatronics

Technical Library: wedge-bond (2)

Wedge Bonding Tool Selection

Technical Library | 2019-05-23 10:30:22.0

Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.

ACI Technologies, Inc.

Copper Wire Bond Failure Mechanisms.

Technical Library | 2014-07-24 16:26:34.0

Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.

DfR Solutions

Events Calendar: wedge-bond (1)

Electronics Packaging Technology Conference - EPTC 2015

Events Calendar | Wed Dec 02 14:00:00 EST 2015 - Fri Dec 04 14:00:00 EST 2015 | Austin, Singapore

Electronics Packaging Technology Conference - EPTC 2015

Institute of Electrical and Electronics Engineers (IEEE)

Express Newsletter: wedge-bond (2)

Partner Websites: wedge-bond (558)

Testverfahren

">ASYMTEK Products | https://www.nordson.com/de-DE/divisions/dage/test-types-2020

& Kanada Nordson DAGE Home Testverfahren Testverfahren Bond Tests   Ball-Schertest Kavitätsschertest Cold Bump Pull Test         Die-Schertest IGBT Schertest High Strain Rate Test          Testen von

">ASYMTEK Products

N2 Imaging Systems - Day 2

| http://www.thebranfordgroup.com/dnn3/Employees/OnlineAuctionAdmin/N2ImagingSystems-Day2/tabid/1869/AuctionID/1599/Default.aspx?page=2

; No Contents Category: 2058 Royce Model 650 Universal Bond Tester, S/N 1005050, w/ Wire Pull, m/n SMW-100G-21845, Leica Microscope and Computer, (2011


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