New Equipment | Assembly Services
Suitable for wire bonder OEM service available.Factory price. Contact: yoyogong@yehengdz.com
For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.
For Wire Bonding (Heavy Wire Wedge Bonding)
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
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