Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Media / Publisher / Online Resource
All Through-hole & SMT PC Board Assembly equipments,Reflow and wavesoldering equipments,Humiseal conformal coating,SCH Technologies conformal coating equipments,Kyzen Cleaning solutions,Metronelec Solderability tester,Curing oven
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
North American Distributor for GEN3 Systems Ltd.test equipment and reliability products, and Inspectis HD Camera inspection tools.
The MPM® Momentum® II BTB™ (Back to Back) configurable stencil printer allows dual-lane processing for higher throughput but without increasing either line length or capital investment. The Momentum II BTB stencil printer is t
New Equipment | Wave Soldering
The Ideal Wave Soldering System for Low-to-Medium Volume Lead-free Pproduction. The award-winning ELECTROVERT VectraES wave soldering system features exceptional system-wide accessibility, an advanced control system and innovative sub-system technol
Electronics Forum | Fri Jul 17 04:18:54 EDT 2020 | sara_pcb
I am looking for test setup for accessing through hole & surface mount soldeability of PCB. Who are the suppliers of wetting balance type test setup
Electronics Forum | Fri Jul 17 05:09:10 EDT 2020 | sara_pcb
I have identified one equipment "MALCOM SWB2 " What is the approx budget required
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2003-08-27 10:43:02.0
This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.
Technical Library | 2023-01-10 20:03:37.0
Since the IPC-4552 rev A for ENIG was introduced there have been many requests for clarification of acceptable and unacceptable levels of nickel corrosion. This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC-4552 rev A and tabulate wetting balance results and congruity of intermetallic formed.
Technical Library | 2017-10-19 01:17:56.0
Wetting balance testing has been an industry standard for evaluating the solderability of surface finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as a function of Time, along with the individual data outputs "Time to Zero" T(0), "Time to Two-Thirds Maximum Force" T(2/3), and "Maximum Force" F(max) are usually used to evaluate the solderability performance of various surface finishes. While a visual interpretation of the full curve is a quick way to compare various test results, this method is subjective and does not lend itself readily to a rigorous statistical evaluation. Therefore, very often, when a statistical evaluation is desired for comparing the solderability between different surface finishes or different test conditions, one of the individual parameters is chosen for convenience. However, focusing on a single output usually doesn't provide a complete picture of the solderability of the surface finish being evaluated.In this paper, various models here-in labeled as "point" and "area" models are generated using the three most commonly evaluated individual outputs T(0), T(2/3), and F(max). These models have been studied to quantify how well each describes the full wetting balance curve. The solderability score (S-Score) with ranking from 0 to 10 were given to quantify the wetting balance curve as the result of the model study, which corresponds well with experimental results.
SMTnet Express, November 19, 2017, Subscribers: 30,938, Companies: 10,768, Users: 23,942 To Quantify a Wetting Balance Curve Frank Xu Ph.D., Robert Farrell, Rita Mohanty Ph.D.; Enthone Wetting balance testing has been an industry standard
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
°C N2 Good Wetting but Surface Finish Looks Grainy (Acceptable ball formation) PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 10 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 2 Tin, Silver Copper, Antimony, BGA 230
