Electronics Forum | Mon Nov 12 01:18:29 EST 2007 | sin4d
Hi, ALL I experience some QFP with wetting issue on the heel of the lead. There is no fillet wetting on the heel which causes reject bt the customer, but not all the QFP. Could anyone pls help what is the causes of this problem, it is due to oxidati
Electronics Forum | Tue Dec 18 18:36:58 EST 2001 | guicho_v
Is the Sn% of the plating of the pin related to wetting quality?. I am having issues with one IC maker where some pins are OK and one or two pins are not soldered, even when there is weeting evidence underneath the pin. I am blaming the %Sn too hig
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | russ
Could be any one of the 3 you mentioned, need some details here, do you really think we can answer this question as it is? Now for your issue, what is the make up of the lead itself on the part? what is the reflow profile at this part? what is
Electronics Forum | Tue Apr 17 10:22:16 EDT 2001 | tom g
Has anyone out there had solder joint wetting issues with Murata ceramic chip caps, in particular with Alpha UP78 no-clean paste? We are finding that changing either the paste or the vendor corrects this problem. If so, please advise your solution(
Electronics Forum | Thu Dec 01 14:24:25 EST 2005 | Amol Kane
Hi, I am having a SAC 305 solder paste with water soluble flux wetting issue. during reflow, the solder melts, but doesnt flow. the reflow profile was developed by the solder company person (Kester). the board is a test assembly to validate our LF pr
Electronics Forum | Thu Dec 01 16:14:45 EST 2005 | chunks
You need to verify if you're getting up to the needed temps. It looks like you're not. I'd say it started to reflow but never reached a long enough time. Nitrogen may help with further wetting.
Electronics Forum | Thu Dec 01 17:24:37 EST 2005 | slthomas
Are you sure you're getting enough paste on the pads? It looks like you may not have enough flux to get the solder to wet properly.
Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef
Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes
Electronics Forum | Thu Dec 01 14:41:06 EST 2005 | Bill C
It looks to me that your reflow profile is not hot enough. Seeing the granular structure of the solder paste still on the board would indicate the paste has not reflowed entirely.
Electronics Forum | Thu Dec 01 14:42:57 EST 2005 | Amol Kane
my first thought was that too, but all the other components on tha board have reflowed properly. I have tow test boards, one with Imm Sn and other with Imm AG. on both these boards only the QFP has this solder phenemenon
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