SFG Electronic Technology Co.,Limited Contact:Andy Tung Cell phone/WhatsApp/Wechat:+86 13751093139 Skype:kelvin-andy Higher quality & higher productivity . . Further pursuing of high quality printing with "the cornerstone of quality is p
Electronics Forum | Thu Feb 14 17:40:34 EST 2013 | jorge_quijano
PCB Supplier made an EDX anaysis, the found a chemical trapped in the holes, and some burnt burrs, according to what they say this stains are over the solder mask & silk, so they do not affect functionality.
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Industry News | 2018-03-24 09:45:36.0
Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pin point the root cause. This is due to the intermittent nature of the failure or just replacing components seems to solve the problem Book at https://www.bobwillis.co.uk/event/dendrite-failure-causes-cures/
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2009-07-01 09:24:25.0
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.
Events Calendar | Mon Mar 09 12:00:00 EDT 2015 - Mon Mar 09 12:00:00 EDT 2015 | ,
Selective Soldering Design & Process Setup Webinar
New BGA Solder Mask Repair Technique Using Laser Cut Stencils If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ New BGA Solder Mask Repair Technique Using Laser Cut Stencils Best, Inc
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“Nominal” environment for library construction, use the “Least” environment for the 0402 (1005) land pattern. Too much solder on this micro-miniature 2-pin component causes tombstoning in the assembly reflow oven