Electronics Forum | Mon Feb 25 21:13:12 EST 2002 | davef
No, none of us can tell you what is the acceptable level of halide content or contamination in flux residue. The level of harmful residues on your product helps determine the reliability of your product. We know nothing of your product, its custome
Electronics Forum | Mon Feb 25 15:09:06 EST 2002 | jax
Kelvin, You can find the Standard acceptable levels and testing procedures from IPC. Here's a little advice from the fellas' over at PCFAB: As a guideline, we recommend that for assemblies processed with low-solids flux technology and that are not cl
Industry News | 2021-11-02 21:30:34.0
What is HMI (Human Machine Interface)? This era is smart and full with information. We have already been placed in the age of smart technology and filled with all kinds of new devices and inventions every day. If you want to get a fully understanding of our era, to understand HMI first is a good idea. This article will take a quick yet deep look at HMI in 4 parts, including HMI definition, HMI components, HMI use, and who are making HMI.
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box) Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box) The tin whisker failures investigated in this paper were
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
