JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:47,000 CPH Product description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050 Board size:50×50-650×370mm Feeder inputs:max.112 placement capacity:47,000 CPH Product description: JUKI RS-1R Pick and Place Machine modular chip mounter Applicabl
Electronics Forum | Fri Jun 19 13:40:25 EDT 1998 | Terry Burnette
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike There has been a
Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby
Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins
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FAQ - PCB Product and Job Tracking Software | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Following the best industry practices for PCB board design and layout can help you avoid this costly mistake. Solder Application – Solder bridging can frequently occur when too much solder is applied to pads
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