New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
Electronics Forum | Mon May 14 19:16:49 EDT 2001 | jagman
Dave: Actually, I'm located in the South Bay (Santa Clara)! Good guess. Now, for more in-depth information: So far, the distribution has been limited to one board out of 10 assembled, so far from one lot. The components assembled are exclusively
Electronics Forum | Fri May 11 15:43:41 EDT 2001 | davef
More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the board (ie, thickness, type, solder ma
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2019-06-20 17:25:01.0
High resolution inspection tool with built-in LCD designed for standalone PCB inspection
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives Thermal Spot Curing of Adhesives with Photonic Energy; A novel fiber delivery
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GPD Global | https://www.gpd-global.com/co_website/thermalImaging-max2.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
parameters such as solder mask, residues from PCBA assembly process, and PCBA layout and components have an influence on the water layer formation on PCBA surface and failures. Therefore it is fundamentally important to understand the influence of these
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