Industry Directory: why using cleaning process used (51)

ZESTRON Americas

Industry Directory | Consultant / Service Provider / Manufacturer / Training Provider

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Kolb Cleaning Technology USA LLC

Industry Directory | Cleaning

The international full service manufacturer of systems, detergents, equipment and process design for the cleaning in electronics production.

New SMT Equipment: why using cleaning process used (5020)

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

Jetting Pump - NCM5000

Jetting Pump - NCM5000

New Equipment | Dispensing

Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design

GPD Global

Electronics Forum: why using cleaning process used (1816)

Note for cleaning process

Electronics Forum | Thu Jun 26 20:54:08 EDT 2008 | davef

As pointed-out above, the downside of telling your supplier how to perform a process can create problems: * It sets the cost of the operation ... I did what you told me to do * Materials selected may be incompatible ... I did what you told me to do *

Note for cleaning process

Electronics Forum | Thu Jun 26 13:55:56 EDT 2008 | dyoungquist

Water will not remove no clean flux residues because they are not water soluble. Solder paste with no clean flux should only be used when the assemblies do not need to be cleaned. That said, you can buy special cleaning solvents specifically for re

Used SMT Equipment: why using cleaning process used (93)

DEK automatic solder paste printing machine

DEK automatic solder paste printing machine

Used SMT Equipment | Pick and Place/Feeders

DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde

KingFei SMT Tech

Electrovert Aquastorm 200

Electrovert Aquastorm 200

Used SMT Equipment | Board Cleaners

Speedline Electrovert Aquastorm 200 In-line Aqueous Cleaner. $15000.  This item is USED but should work as intended. This item came from a working environment. THIS ITEM COMES WITH WHAT YOU SEE IN THE PICTURES IF YOU DON’T SEE IT, YOU P

World Equipment Source / R1 Source, Inc.

Industry News: why using cleaning process used (1511)

Jigar Patel, ZESTRON, to Present at the Colorado Cleaning and Reliability Workshop

Industry News | 2013-09-25 19:14:26.0

ZESTRON is pleased to announce that Jigar Patel, Senior Process Engineer, ZESTRON, will present “Defluxing in a No-Clean & OA World” at the Colorado Cleaning and Reliability Workshop on Tuesday, October 22nd.

ZESTRON Americas

ZESTRON to Present “PCB Cleaning Before Conformal Coating” at the First SMTA Technical Forum in Guadalajara, Mexico

Industry News | 2011-11-08 15:03:07.0

Mr. Axel Vargas, Application Engineer at ZESTRON will present “PCB Cleaning Before Conformal Coating” at the first SMTA Technical Forum in Guadalajara, Mexico

ZESTRON Americas

Parts & Supplies: why using cleaning process used (760)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Yamaha Second Hand Surface Mount Placement Machine YAMAHA Remote Controller KH1-M5180-20X

Yamaha Second Hand Surface Mount Placement Machine YAMAHA Remote Controller KH1-M5180-20X

Parts & Supplies | Assembly Accessories

Detailed Product Description Original: Japan Model: 8G2 510148 Condition: Original Used Application: YV100II Machine Part Name: Remote Controller Stock: Yes Second Hand Surface Mount Placement Machine YAMAHA Remote Controller KH1-M5180-20X

KingFei SMT Tech

Technical Library: why using cleaning process used (33)

Why Switch From Pure DI-Water to Chemistry

Technical Library | 2009-12-22 21:47:08.0

While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge.

ZESTRON Americas

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: why using cleaning process used (142)

HELLER INDUSTRIES Presents: Formic Acid Sintering

HELLER INDUSTRIES Presents: Formic Acid Sintering

Videos

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

Time Pressure with Real Time Process Control FPC

Time Pressure with Real Time Process Control FPC

Videos

http://www.gpd-global.com Pair Time Pressure with Real Time Process Control (Fluid Pressure Control) to dispense Solder Mask WSOL with outstanding result. Watch this dispensing process on a bench top robot. More Info: http://www.gpd-global.com/co_w

GPD Global

Training Courses: why using cleaning process used (17)

Virtual Course: Cost Conscious Test Strategies for Electrical Cost Products

Training Courses | ONLINE | | Other Courses

Other courses related to electronics manufacturing and assembly

Surface Mount Technology Association (SMTA)

Electronics Manufacturing Processes (Boot Camp A)

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

Events Calendar: why using cleaning process used (29)

Why Cleaning is Critical Before Conformal Coating MARCH 22nd

Events Calendar | Tue Mar 22 00:00:00 EDT 2022 - Tue Mar 22 00:00:00 EDT 2022 | ,

Why Cleaning is Critical Before Conformal Coating MARCH 22nd

ZESTRON Americas

LED Cleaning and Reliability - Online Webinar

Events Calendar | Thu Sep 27 00:00:00 EDT 2018 - Thu Sep 27 00:00:00 EDT 2018 | ,

LED Cleaning and Reliability - Online Webinar

ZESTRON Americas

Career Center - Resumes: why using cleaning process used (37)

Cad designer

Career Center | Daviddav, India | Engineering,Maintenance,Production,Quality Control,Research and Development

Created and defined component landing patterns for high density layouts beyond the specifications of IPC standards and in compliance with RoHs. • Designing SMT stencils (Solder paste & Glue(Epoxy) stencils).

SMT QUALITY ENGINEER

Career Center | INDIA, India | Engineering,Quality Control

BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.

Express Newsletter: why using cleaning process used (1063)

SMTnet Express - January 15, 2014

SMTnet Express, January 15, 2014, Subscribers: 26472, Members: Companies: 13551, Users: 35633 Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices by Brian Czaplicki; Air-Vac Engineering BGA

Partner Websites: why using cleaning process used (1800)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores

Heller Industries Inc.

Underfill Process | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill

Underfill Process | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets

ASYMTEK Products | Nordson Electronics Solutions


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