Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Zetech was established in 1986 with the intention of supplying Industrial Equipment, Manufacturing Equipment, Consumable Materials, Software and Technical Support to the Electronics and Manufacturing Industry in South Africa.
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Rework & Repair Equipment
Desoldering braid (wick) is copper braid used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics. Electronic components are often mounted on a circuit board and careful desoldering of components results i
Electronics Forum | Wed Feb 10 08:10:26 EST 2010 | davef
Here is a posting by P Kinner at Humiseal ... Typically, there are three main approaches to avoid coating wicking into press-fit connectors (and other keep out areas). Wicking is a phenomenon caused by a combination of low viscosity of conformal coa
Electronics Forum | Fri Feb 05 20:39:41 EST 2010 | localperm79
I've recently been placed in control of operations of our SCS conformal coat sprayer and I must eliminate problems with wicking of humiseal 1b73 into surface mount connectors while also trying to minimize masking as much as possible. We use a 55:45
Industry News | 2011-02-09 14:50:49.0
Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Industry News | 2023-07-22 06:55:33.0
Seamless Setup for Security Camera Turnkey Semi-Auto JUKI SMT Line - Hassle-Free Guide to Kickstart Production at Your Facility. Discover the easiest way to integrate cutting-edge technology, accelerate efficiency, and ensure top-notch quality. Follow our step-by-step process and equip your facility for success in the security camera industry today
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: LNC60 I/F Cable ASM Part Number: 40070445 Machine: JUKI KE2070 2080 FX3 Machine Condition: Original New Brand: JUKI Application: For LNC60 Laser 40070445 LNC60 I/F Cable ASM(2012) For JUKI 2070 2080 FX3 Mac
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Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI 2010 2020 2030 2040 OPERATION PCB E86057290A0 Original new and used Supply all juki spare parts at low price JUKI CM300200004 SAFETY LABEL (50) FUJINTAI TECHNOLOGY CO.,LTD JUKI CM300200006 SAFETY LABEL (100) www.fujintai.com JUK
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2021-07-20 20:12:20.0
Motivation: High reject rates for PCBs due to specification non-conformances Multiple rebuilds causing impactful schedule delays + Copper Wrap + Wicking + Etchback + Annular Ring Are rejected boards reliable? What are PCB quality requirements for? + Reliability: fewer cycles-to-failure? + Manufacturability: define threshold of modern manufacturing capability?
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
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