Industry Directory: wire bond (38)

ISVI - Industrial Sensor Vision International Corporation

Industry Directory | Inspection

Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.

Majelac Technologies

Industry Directory | Assembly / Components / Substrates / Pick and Place / Contract Manufacturer

Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,

New SMT Equipment: wire bond (154)

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

New Equipment | Cleaning Agents

pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues from a wide range of se

ZESTRON Americas

HYDRON® SE 230A

HYDRON® SE 230A

New Equipment | Cleaning Agents

Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro

ZESTRON Americas

Electronics Forum: wire bond (199)

COB and wire bond

Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh

Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,

COB and wire bond

Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef

4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New

Used SMT Equipment: wire bond (19)

Nicolet NXR-1500

Nicolet NXR-1500

Used SMT Equipment | X-Ray Inspection

Very Nice Nicolet Xray Machine For Sale The system is complete and in good working condition See attached pictures and information below Nicolet Imaging Systems Model Number: NXR-1500 Serial Number: 0150011 Year 2000 Variable Speed Joystick

1st Place Machinery Inc.

YesTech YTX-3000

YesTech YTX-3000

Used SMT Equipment | X-Ray Inspection

Yestech High Resolution Imaging PCB Xray Serial Number: X10706656 Model Number: YTX 3000 Year 2007-2008 130 KV XrayTube with 5 micron spot size Xray on Hours - 18.2 Standby Hours - 328.5 Measured Filament - 2.22 Hamamatsu L19181-02 Sample Ma

1st Place Machinery Inc.

Industry News: wire bond (236)

Ravi Parthasarathy, ZESTRON, to Present at IMAPS’s Advances in Semiconductor Packaging Exhibition

Industry News | 2015-09-22 18:05:39.0

ZESTRON is pleased to announce that Ravi Parthasarathy, Senior Process Engineer, ZESTRON, will present “Impact of Cleaning Technologies on Lead Frame Packages: The Difference in Wire Bond Yields” at IMAPS’s Advances in Semiconductor Packaging Exhibition on September 24th.

ZESTRON Americas

MIRTEC PICKS UP ITS 24TH INDUSTRY AWARD AT SMTAI

Industry News | 2014-09-30 18:49:51.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2014 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.

MIRTEC Corp

Parts & Supplies: wire bond (6)

Universal Instruments series

Universal Instruments series

Parts & Supplies | SMT Equipment

UNIVERSAL Series No. P/N description 201 17190000 RAIL, CAM 202 17191000 SHAFT 203 17195003 DRIVER TIP-RH 204 17195004 DRIVER TIP-RH 205 17196003 DRIVER TIP-LH 206 17196004 DRIVER TIP-LH 207 17197007 FORMER-RH STD 208 171980

Wisdom Shining Electronic Technology (China) Limited

Universal Instruments Universal series

Universal Instruments Universal series

Parts & Supplies | SMT Equipment

UNIVERSAL Series No. P/N description 201 17190000 RAIL, CAM 202 17191000 SHAFT 203 17195003 DRIVER TIP-RH 204 17195004 DRIVER TIP-RH 205 17196003 DRIVER TIP-LH 206 17196004 DRIVER TIP-LH 207 17197007 FORMER-RH STD 208 171980

Wisdom Shining Electronic Technology (China) Limited

Technical Library: wire bond (18)

Wedge Bonding Tool Selection

Technical Library | 2019-05-23 10:30:22.0

Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.

ACI Technologies, Inc.

Non-Destructive Test Methods

Technical Library | 2019-09-23 09:35:00.0

Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).

ACI Technologies, Inc.

Videos: wire bond (13)

This is a brief functional demonstration of the Xylon Cheetah X-ray.  The video shows the machine x-ray components on a pcb.  In the video, you can see wire bonds and solder voids

This is a brief functional demonstration of the Xylon Cheetah X-ray. The video shows the machine x-ray components on a pcb. In the video, you can see wire bonds and solder voids

Videos

This is a brief functional demonstration of the Xylon Cheetah X-ray. The video shows the machine x-ray components on a pcb. In the video, you can see wire bonds and solder voids. This 2011 Cheetah is available at the Capital Equipment Exchange.

Capital Equipment Exchange

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Training Courses: wire bond (3)

Chip Scale Manufacturing Training Course

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

IPC-7711/7721 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-7711/7721 Specialist (CIS)

The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.

Technical Training Center

Events Calendar: wire bond (2)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Electronics Packaging Technology Conference - EPTC 2015

Events Calendar | Wed Dec 02 14:00:00 EST 2015 - Fri Dec 04 14:00:00 EST 2015 | Austin, Singapore

Electronics Packaging Technology Conference - EPTC 2015

Institute of Electrical and Electronics Engineers (IEEE)

Career Center - Resumes: wire bond (7)

Sales

Career Center | Chennai, India | Sales/Marketing

Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali

Technical Specialist

Career Center | SanPedro, Philippines | Maintenance,Production

Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan

Express Newsletter: wire bond (802)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding

Partner Websites: wire bond (1103)

Nordson MARCH White Paper, Plasma Clean to Reduce Wire Bond Failures, Now Available Online

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-white-paper-plasma-clean-to-reduce-wire-bond-failures-now-available

Nordson MARCH White Paper, Plasma Clean to Reduce Wire Bond Failures, Now Available Online MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications

ASYMTEK Products | Nordson Electronics Solutions


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