Industry Directory: wire bonder shinkawa (8)

Palomar Technologies

Industry Directory | Manufacturer

manufacturer of die and wire bonders

Microvision, Inc.

Industry Directory | Manufacturer

bonding equipment wire bonders

New SMT Equipment: wire bonder shinkawa (97)

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

New Equipment | Assembly Services

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

Dongguan Intercontinental Technology Co., Ltd.

Electronics Forum: wire bonder shinkawa (23)

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

gold wire bonding

Electronics Forum | Fri Jan 20 02:34:16 EST 2006 | yihui

Hi, i'm david, new to this forum. Came across your posting about using a delvotec bonder to TS bond to a ENIG pad. Given that the immersion gold layer is thin, does the capillary scrub through the gold layer to expose the underlying nickel? Does your

Used SMT Equipment: wire bonder shinkawa (27)

Panasonic BM231

Panasonic BM231

Used SMT Equipment | SMD Placement Machines

  ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand: CP40L; CP40LV; CP45F; CP45FV;  CP45FVneo); YAMAHA SMT mac

I.C.T

Yamaha Ys12

Yamaha Ys12

Used SMT Equipment | Chipshooters / Chip Mounters

  ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand: CP40L; CP40LV; CP45F; CP45FV;  CP45FVneo); YAMAHA SMT mac

I.C.T

Industry News: wire bonder shinkawa (38)

Baja Bid Online Auction – June 3-5, 2014 (Featuring Items From OneChip Photonics)

Industry News | 2014-05-22 15:42:29.0

Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.

Baja Bid

OneChip Photonics Facility In Canada Closing – All Assets Being Sold

Industry News | 2014-06-03 13:04:15.0

The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.

Baja Bid

Videos: wire bonder shinkawa (3)

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

Videos

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

Dongguan Intercontinental Technology Co., Ltd.

Viscom AOI

Viscom AOI

Videos

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Career Center - Jobs: wire bonder shinkawa (4)

Engineering Specialist

Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control

Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg

Harris

R&D technician

Career Center | San Jose, California USA | Research and Development

Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets.  You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag

Avago Technologies

Career Center - Resumes: wire bonder shinkawa (5)

Equipment Maintenance Technician

Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support

                                                 Duties & Responsibilities (Equipment Technician):  Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment.  Conduct Preventive maintenance

Experienced Technical Specialist

Career Center | , Philippines | Engineering,Technical Support

Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal

Express Newsletter: wire bonder shinkawa (859)

Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process

Partner Websites: wire bonder shinkawa (222)

ESEC 3006

1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_semiconductor_esec3006.html

ESEC 3006   ESEC Sempac Wire Bonder Model # 3006S Type W112 Fab No 300357 Year 1999-2000 1.44 MB Floppy Olympus Microscope-Model SZ30

1st Place Machinery Inc.

Samsung Pick And Place Machine Development History - Dongguan Intercontinental Technology Co.,Ltd.

| https://www.smtfactory.com/Samsung-Pick-And-Place-Machine-Development-History-id40845177.html

: Launched CP-11 high-speed pick and place machine development, launched SWB--100G wire bonder 1996: Launched medium-speed CP--30 high-speed pick and place machine


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