Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Used SMT Equipment | Circuit Board Assembly Products
running condition for aluminum wire bond
Used SMT Equipment | AOI / Automated Optical Inspection
Single lane 3 position conveyor; 12" x 12" work area; 5MP camera; die bond and wire bond inspection.
Used SMT Equipment | Wire Harness Testers
we need used wire Bond ; K &S Type：ICONNX CONNX LED Any thing for selling pls noted me
Used SMT Equipment | Visual Inspection
VISCOM S6056BO in like-new condition - checked by Viscom engineer and it is in a very good running condition. Wire bond inspection
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Used SMT Equipment | Adhesive Dispensers
Asymtek Millennium 600 Epoxy Dispenser For Sale Vintage 1998 Integrated mass flow calibration system automatically compensates for changes in fluid viscosity Full temperature control of fluid delivery with closed-loop substrate heating to
Used SMT Equipment | Semiconductor & Solar
Becoming available soon; K&S 4124 Wire Bonding Machine currently in production to be removed in complete working condition. Contact: Assured Technical Service LLC Minneapolis, MN 55441 AssuredTechnicalServiceLLC@Gmail.com FOB Origin. The
Used SMT Equipment | Semiconductor & Solar
Nordson MARCH AP-300 Plasma System Cleaner 100-230VAC, 50/60Hz, 3.5A @208V, Single Phase A compact and benchtop model, the Nordson March plasma system AP-300 has a volume capacity of 33.1 liters, supported by up to seven (7) adjustable shelves in
Used SMT Equipment | Chipshooters / Chip Mounters
(3) Fuji CP743E Chipshooters; 2003 - 2004 vintage. All consigned into the High Technology Exchange on March 12-14 on www.xlineassets.com List of additional equipment includes: TEST AND MEASUREMENT: Advantest Spectrum Analyzers Rhode and Schwa
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
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