Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
IPC is the trade association for the printed wiring board and electronics assembly industries.
New Equipment | Design Services
We provide 5G design services IOT including an expansive choice of engineering services pertaining to Internet of Things Networks that are sensor-driven in nature, ranging from IoT architecture designing and development to manufacturing. EDGE DEVICE
New Equipment | Rework & Repair Equipment
Angled Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Angled Flat Reamer: SH-20D Tools with the Standard Angled Flat Reamer: SH-20B Applications 30 degree bend at the tip allows access to more difficult areas. Us
Electronics Forum | Thu Feb 16 13:03:52 EST 2006 | Tom Winchell
Assuming the AL tape shorts the wires for the thermocouple, you effectively have three junctions at the business end of the wire: wire 1 to AL, wire 2 to AL, and wire 1 to wire 2. If the temperature of the junctions wire 1 to AL and wire 2 to AL are
Electronics Forum | Thu Dec 30 09:56:04 EST 1999 | Judy Forbes
Preleg wire is an epoxy coated wire. Is there an IPC standard or general rule for how Preleg wire (30 Awg) should be tacked down? Should it be tacked down every 1" as is regular wire - Or should it be tacked the whole length of the wire?
Used SMT Equipment | Wire Strippers
We have an immediate need for Autosplice SAS splice machines. If you have one, or multiple; please contact me asap. Thanks ashlin@bajabid.com 813-992-2437
Used SMT Equipment | THT Equipment
Universal Jumper wire er. Come from production, good condition Model:6683C
Industry News | 2003-05-12 09:19:51.0
No larger than conventional 12A wire-to-board connectors for PCB applications
Industry News | 2003-05-02 08:01:53.0
Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.
Parts & Supplies | Pick and Place/Feeders
YAMAHA KM1-M66A6-001 YV100II HEAD UP AND DOWN WIRE More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com , thanks.
Parts & Supplies | Pick and Place/Feeders
YAMAHA KM1-M66E4-102 YV100II HEAD VACUUME WIRE More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com , thanks.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
03010415S01 Tension Spring Z-051GX 03010444S02 Hose, Placement Circuit 3*6*125 03010445S01 Hose, Query Placem.Circ.,6-Nozzle Head 03010482-01 LINE FILTER 03010496-01 CABLE FOR MOTOR MTC 2 03010513-01 CONTACTOR 3RT1015-1JB42 03010565-01 CALIBRAT
03010187S01 PE-UHMW FOIL 42,5 x 0,5 mm x 40m/Rol 03010315S01 Maglev MWA120-0064 03010326S01 PE-UHMW GLUE TAPE 50 x 0,3mm x 16,5m 03010329S01 HOLDER FEEDER SLIDE SPRING/X8 03010352-01 Tension spring d=0,63* D=5,6* Lo=23,3 03010415
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS) Recert.
The Certified IPC/WHMA-A-620 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC/WHMA-A-620 Specialist.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Wed Feb 19 00:00:00 EST 2020 | Las Vegas, Nevada USA
IPC & WHMA Wire Harness Manufacturing Conference
Events Calendar | Thu Sep 27 00:00:00 EDT 2018 - Fri Sep 28 00:00:00 EDT 2018 | Lyon, France
IPC/WHMA Cable and Wire Harness Assemblies Conference
Career Center | San Diego, California USA | Engineering
MeltroniX is a supplir of MCM/hybrids for the military and space market. We are seeking a process engineer with expertise in wire bonding, including ultrasonic and thermocompession technology.
Career Center | Norcross, Georgia USA | Production
Cable Wire Assembler Reports to: Supervisor Responsibilities: Perform quality checks for daily activities such as mechanical assembly, cable wiring, and etc. in a group under the supervisor's vision. Wire the panels by following the provided p
Career Center | , India | Production
Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat
Career Center | , New Jersey USA | Engineering,Management,Production,Research and Development
A highly experienced Engineering/Manufacturing Manager with 40 years of experience in electronic/mechanical design and manufacturing. Recent years, specializing in electronic manufacturing with emphasis on Surface Mount Technology. Currently employed
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
| https://www.eptac.com/blog/wired-for-success
Wired for Success: The Journey of a Master Solderer and Quality Inspector Looking for solder training standards, manuals, kits, and more
| http://etasmt.com/cc?ID=te_news_industry,26963&url=_print
: The double-sided board is a printed circuit board with copper coated on both sides including Top (top) and Bottom (bottom). Both sides can be wired and soldered
