New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Solder Materials
Easily Reball BGA components for as little as a penny each. No solder paste required. Re-Ball components using our water wash tacky flux. No more expensive and hard to order solder pre-forms. Call (888) 406-2830
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! Easy placement and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMD's using this BGA Rework Station with color optical system that h
New Equipment | Cleaning Equipment
Fully automatic online PCBA cleaning machine-SMS-6300 SMS6300 is an online, integrated, fully automatic PCBA cleaning machine, used for rosin flux, no-cleaning flux, water-soluble flux, solder paste and other organic and inorganic pollution remainin
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
