Industry News | 2020-04-11 14:25:00.0
Increased capabilities in lab will support increased research and training opportunities in photonic
Industry News | 2023-05-15 17:38:25.0
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.
Industry News | 2023-10-23 09:48:49.0
IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Industry News | 2001-11-27 13:09:48.0
IPC has announced its tutorial and workshop schedule for IPC Printed Circuits Expo 2002. A total of 34 courses are scheduled, including 15 full-day tutorials on March 24-25, and 19 half-day workshops, which will take place on March 25 and 28.
Industry News | 2024-03-26 13:55:04.0
Today's system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
Industry News | 2023-11-27 12:51:49.0
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product, the highly precise photonics bonder. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
Industry News | 2023-11-20 13:52:50.0
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product the highly precise photonics bonder at productronica 2023 in Munich. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
Industry News | 2009-12-14 21:05:51.0
December 2009 ? Christopher Associates, a pioneering supplier and distributor to the photovoltaic industry, will feature Tonsan sealants and compounds in booth K13 at PHOTON’s upcoming 5th Photovoltaic Technology Show scheduled to take place February 2-4, 2010 at the Moscone Center in San Francisco.
Industry News | 2010-02-25 15:08:40.0
February 2010 - Christopher Associates announces the release of the Unisonik 414R fluxless ultrasonic soldering robot from Japan Unix, the world leading robotic soldering system manufacturer. Christopher Associates introduced the system at the Photon International show for photovoltaic manufacturing, held at the Moscone Center in San Francisco, and received an excellent response.
Industry News | 2012-03-30 18:48:18.0
Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.
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