Technical Library: young and aspire (Page 1 of 2)

SMT Manufacturability and Reliability in PCB Cavities

Technical Library | 2012-05-31 18:01:31.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such

AT&S

Manufacturing Operations System Design and Analysis

Technical Library | 1999-05-06 14:48:20.0

This paper describes manufacturing operations design and analysis at Intel. The complexities and forces of both the market and the manufacturing process combine to make the development of improved semiconductor fabrication manufacturing strategies (like lot dispatching, micro and macro scheduling policies, labor utilization, layout, etc.) particularly important...

Intel Corporation

New Methods of Testing PCB Traces Capacity and Fusing

Technical Library | 2011-11-25 16:07:47.0

The article presents virtual and real investigations related to current capacity and fusing of PCB traces in high power applications and is based on a scientific paper delivered by authors at SIITME 2010 in Romania. The reason of performing the research a

UPB-CETTI University of Bucharest, Center for Technological Electronics and Interconnection Techniques

COVID-19 - Managing Supply Chain Risk and Disruption

Technical Library | 2020-06-12 00:12:13.0

Responding to the immediate challenge While COVID-19 may be the catalyst for companies to revisit their global supply chain strategy and accelerate the adoption of Digital Supply Network models and capabilities, short-term actions need to be made to respond to the immediate challenge.

Deloitte

Evaluation of Stencil Foil Materials, Suppliers and Coatings

Technical Library | 2011-12-08 17:46:42.0

The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c

Shea Engineering Services

Effect of Morphology of Calcium Carbonate on Toughness Behavior and Thermal Stability of Epoxy-Based Composites

Technical Library | 2020-10-14 14:49:14.0

In this study, the modification of an epoxy matrix with different amounts of cube-like and rod-like CaCO3 nanoparticles was investigated. The effects of variations in the morphology of CaCO3 on the mechanical properties and thermal stability of the CaCO3/epoxy composites were studied. The rod-like CaCO3/epoxy composites (EP-rod) showed a higher degradation temperature (4.5 _C) than neat epoxy. The results showed that the mechanical properties, such as the flexural strength, flexural modulus, and fracture toughness of the epoxy composites with CaCO3 were enhanced by the addition of cube-like and rod-like CaCO3 nanoparticles. Moreover, the mechanical properties of the composites were enhanced by increasing the amount of CaCO3 added but decreased when the filler content reached 2%. The fracture toughness Kic and fracture energy release rate Gic of cube-like and rod-like CaCO3/epoxy composites (0.85/0.74 MPa m1/2 and 318.7/229.5 J m

Inha University

Graphene electronic fibres with touch-sensing and light emitting functionalities for smart textiles

Technical Library | 2019-08-29 13:04:55.0

The true integration of electronics into textiles requires the fabrication of devices directly on the fibre itself using high-performance materials that allow seamless incorporation into fabrics. Woven electronics and opto-electronics, attained by intertwined fibres with complementary functions are the emerging and most ambitious technological and scientific frontier. Here we demonstrate graphene-enabled functional devices directly fabricated on textile fibres and attained by weaving graphene electronic fibres in a fabric. Capacitive touch-sensors and light-emitting devices were produced using a roll-to-roll-compatible patterning technique, opening new avenues for woven textile electronics. Finally, the demonstration of fabric-enabled pixels for displays and position sensitive functions is a gateway for novel electronic skin, wearable electronic and smart textile applications.

University of Exeter, College of Engineering, Mathematics and Physical Sciences

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Technical Library | 2017-09-07 13:56:11.0

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.

Teledyne DALSA

Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints

Technical Library | 2010-04-29 21:40:37.0

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

Flex (Flextronics International)

Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework

Technical Library | 2012-12-20 14:36:09.0

The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011

Indium Corporation

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