Electronics Forum: soldering and problems and with and qfn (Page 1 of 2)

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Working with Lead free and Pb Capacitors

Electronics Forum | Fri Jan 27 15:12:48 EST 2006 | GS

From technical point of view: it should not be a problem to mix Pb with Pb Free components soldered with a LF solder process. You have to take care about the max temperature allowed on your Pb components and make sure they can withstand the higher

Working with Lead free and Pb Capacitors

Electronics Forum | Fri Jan 27 10:58:11 EST 2006 | mafc65

We are running our prduction (TV's)with Lead Free Solder, since 1 year ago, but we still have a lot of Electrolityc Capacitor (Thruhole and SMT)in stock that are for PB Solder. We have to use them before February-06. Do anybody know if there is a pro

Problems with Vision and White Soldermask

Electronics Forum | Tue Aug 02 10:46:03 EDT 2016 | proceng1

We are getting more and more customers wanting LED boards built on White Solder Mask. Well our printers do not get as much contrast between the white mask and the plated fiducial pad, and often the camera only sees white. Other than playing with

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

Couple of questions. 1) Are we talking alumina substrates as the ceramic material? 2) Are we co-firing gold as the conductors on the substrate surface? 3) In other words, is this a hybrid thick film circuit? 4) If so, how large or

QFN's and LGA's

Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman

Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

Reflow issues with leaded paste and mixed components

Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero

Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo

Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof

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