Electronics Forum: plating (Page 101 of 260)

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 15:17:21 EST 1999 | Earl Moon

| | Hello, | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | So far, the tests I can think of performing, and tha

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F

Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft

Re: Press fit connnector

Electronics Forum | Wed Feb 09 21:45:48 EST 2000 | Dave F

Sal: Hey that customer standing around staring at you sound like fun, yeh right!!! Wolfgang makes good sense, but, in addition, I�d like to drill-down on board fabrication (har har har) a little bit (har har har) more. You say the holes are the cor

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem

We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself

Re: Release difficult from thick stencil

Electronics Forum | Wed Nov 01 12:19:42 EST 2000 | Fraser

Steve, someone somewhere is feeding you a line!! if you increase the draft angle from || to / \ on your laser cut stencil you increase the surface area of the side wall and hence increase the likelyhood of the paste sticking in the aperture. Whats m

Re: Plating crack

Electronics Forum | Wed Sep 27 17:24:08 EDT 2000 | Wolfgang Busko

Ashok: Plating thickness and ductility of the copper are things to look for. If it�s a crack where two layers are pressed together one possible cause could be bad process parameters while pressing these layers together at the PCB shop with the resul

Re: Gold Fingers Discoloration

Electronics Forum | Wed Jul 05 17:06:36 EDT 2000 | Michael Parker

Patrick- You have not given enought detail of the type of discoloration. Is it "white residue"? Can it be "rust" colored? Whatever it is, you fab supplier needs to be called in immediately and give you an exact reason for this failure. Just rubbing

qfp and soic joint Problem

Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith

I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.

Re: feeder extension

Electronics Forum | Wed Mar 29 17:10:25 EST 2000 | Jon Wentz

Hi Dave, What feeder model do you have? I took a quick look in my parts list manual and again, depending on your feeder model, you might be able to buy the needed part(s) from Zevatech/Juki. Have you checked with them yet? For example, the main feed

Re: Vias Under Discrete Components

Electronics Forum | Wed Mar 15 20:28:17 EST 2000 | Dave F

Armin: Locating vias within the courtyard of components is bad practice. Concerns are: * Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out o


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