Electronics Forum | Wed Jun 13 21:25:48 EDT 2001 | dougk
We've tried the MPM rheo., with excellent results. We saw a decrease in fine-pitch pad coverage rejects from ~20% to bacicially ~0%. Print speeds went from 1-2 in/sec (metal blade) to 4-5 in/sec (rheo.). Could probably go faster. Great throughput. Li
Electronics Forum | Wed Feb 17 11:31:37 EST 1999 | Bill Schreiber
Dear Al, Are these reworked, double-sided boards? If you attempt to clean side #2 of double-sided misprint in a "spray" type cleaner, millions of solder balls can be broadcast throughout the same chamber as the populated side #1. Or, if this is a s
Electronics Forum | Tue Jan 26 19:43:02 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Tue Jan 26 19:43:26 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Fri Jul 17 11:49:58 EDT 1998 | Justin Medernach
| My question is in regards to how exactly temperature and humidity affect the stencil printing process. If temperatures here at the plant in the summer are 70-73 degrees F. and relative humidity is 60-65%,to what extent will the results of the ste
Electronics Forum | Tue Oct 14 11:34:04 EDT 2003 | Axl
As far as solder paste goes search no further! I have worked for some huge CM's as a Process Engineer and a lot of them have put thousands of hours of Engineering time and evaluation just to come up with the same answer every time. For no-clean it is
Electronics Forum | Thu Nov 02 18:56:10 EST 2006 | darby
John, As Dave says, never clean raw paste. Let it sit for at least 24 hrs if you can and use a plastic spatula to wipe off the bulk of it. The "drier" the paste the easier it is to remove without it travelling down vias etc. You will then have to cho
Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris
I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90
Electronics Forum | Sat May 29 22:10:28 EDT 1999 | Earl Moon
| We are looking into frameless stencil systems for screen printing. Outside frame size of 29x29. | | Pros: smaller storage requirements and cheaper stencils. | | Cons: sharp metal edges, additional change over time required | | Can anyone relay
Electronics Forum | Fri Jan 30 14:18:24 EST 1998 | M cox
| | Using metal squeegees on GSPs has caused premature stencil wear. Has | | anyone had any success with this combination? How much snap off did you | | use? We are using .5 mm pitch and have a no clean process. | I have been using lots of metal
