Electronics Forum | Fri Jan 15 16:55:50 EST 1999 | Chrys
| | | Hello, | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | So far, the tests I can think of performin
Electronics Forum | Thu Dec 24 13:29:19 EST 1998 | Chris Grendler
| | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The
Electronics Forum | Thu Nov 12 18:39:10 EST 1998 | Phillipf fHunter
| Here is a good one for ya. Our IP3's MTU will not pick QFP240's out of cavities, 10, 12, 13, 15. This is a 3X8 tray. The listed cavities are also the closed cavities that are used for tray eject. There is plenty of vaccum, the nozzle comes down
Electronics Forum | Wed Sep 09 20:07:41 EDT 1998 | Dave F
| I am attempting to locate a kit to be used on surface mount equipment to determine the placement capability (CPk). Does anyone have information on where to purchase such a kit? Ideally this kit should be usable on placement equipment from various
Electronics Forum | Thu Aug 06 13:09:37 EDT 1998 | Ben Salisbury
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW
| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any
Electronics Forum | Wed Jun 17 14:46:18 EDT 1998 | Robert Smith
1. I need to be able to probe into my product's substrate which has all components in die form. I would need to be able to bring out any pad information for hookup to a scope or any other external piece of equipment. I do not have the convenience o
Electronics Forum | Sun May 24 08:24:29 EDT 1998 | Dave F
| | My question is: How does one recognize paladium leads so that the profile can be set properly? | | Dave F | Hi Dave, | It's kinda' subjective, but what I think it looks like is almost like having a nickel appearance to it, it's smoother and
Electronics Forum | Mon Mar 30 12:55:16 EST 1998 | Justin Medernach
| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi
Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon
| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow