Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019
Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les
Electronics Forum | Mon Aug 16 13:38:35 EDT 2010 | rl
i would like to request some advice on manually dispensing paste for super fine pitch components. first some background. i am a small design house and specialize in sub-miniature prototypes for avionics. so far, i have mostly used stainless steel st
Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev
Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Sun Feb 10 16:35:06 EST 2008 | neocera
Hi, I have a PCB with a blown PMIC (power management integrated circuit) multi voltage regulator IC. The PCB is rather rare and I need to replace the PMIC, its footprint is 7mm X 7mm with 12 solder points per side. Unfortunately I can only solder th
Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Tue Jun 09 13:16:18 EDT 2009 | jack100
We are looking at feasibility concerns of using a QFN 16 from Motorola. I have a couple of questions regarding their recommended PCB design guidelines. 1) Does anyone know why they would recommend coming out of the pads with a narrow trace (.1mm wid
Electronics Forum | Thu Mar 01 16:39:29 EST 2012 | triadelectronics
Our company is going to attempt to place 0201 components using our Fuji CP4-3 with the upgraded SMD3 vision system. Count On Tools is providing the 0.4 mm nozzles and we are using our 8mmX2mm feeders with the 0.7mm tape leaf (if it works at all we w
Electronics Forum | Fri Apr 06 16:36:39 EDT 2007 | mika
Ah, I almost forget (forgot?) to mention that according to the Gerber files (which is the info we send to the PCB-house) the PCB land pattern for this LGA-36 0.35mm rounded pads and the boardhouse cannot achieve this. I understand them; 0.35mm pads,
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
