Electronics Forum | Wed Mar 08 07:24:36 EST 2000 | Wayne Bracy
Scott Wish we could all quite showing our age and just enjoy the SMTNet. Most of us enjoy reading the responses and at times responding to issues that are important to all of us. Technical information is so important to all of us. Most of the Old
Electronics Forum | Wed May 09 15:15:52 EDT 2001 | caldon
Your process needs some refining. How long did it take to wet? How much force did it take to break the surface tension? What type of solder was in the solder pot? What type of flux was used? What was the pot temperature? Did you take a cap and p
Electronics Forum | Fri Aug 03 16:46:59 EDT 2001 | davef
It's OK to have a thin film or haze of paste left on the stencil. Printing nice bricks of paste is the important thing. Assuming you know these things, so tell us more about your situation. PRINT QUALITY: What do your paste deposits look like?
Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup
Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and
Electronics Forum | Thu Oct 14 09:05:17 EDT 1999 | Brian
Nancy, Cliff, There are pros and cons. Some of the longer threads take an age and a day to download when the server is busy, if everything is intact since the birth of Adam. Personally, I prefer it as is because I'm damn lazy and hate scrolling down
Electronics Forum | Mon Oct 11 12:27:48 EDT 1999 | Mike Demos
Thank you all for your replies. I guess my age in this industry is showing. This military spec. does not appear to be in existance. So, let me make my request a little more to the point: Is anyone aware of a specification specifically referencing
Electronics Forum | Thu Sep 16 16:51:24 EDT 1999 | Ryan
I have a number of hopefully easy questions: 1. Are there significant differences in the ease of change-overs and set-up among different equipment manufacturers? For example, are Siemens Siplace machines truly more modular than others? 2. Is ther
Electronics Forum | Fri Sep 17 15:15:10 EDT 1999 | Dave F
snip | | So Ryan have we just gotten back from lunch with someone? | | Yes, and for a rookie, it was mildly confusing. I'm as of recent, a regular "reader" of the forum and thought it might be (and it is!!!) a good place to get other opinions. |
Electronics Forum | Wed Apr 28 19:53:22 EDT 1999 | Earl Moon
| | I am glad you decided to stay with us. Keep dreaming about Mexico. | | | | Nancy | | | Nancy: You shouldn't encourage him!! | Dave, you sweet - what the hell is my automatic answering thang doing, Isn't she sweet. Probably never been to Meh
Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause
