Electronics Forum: corners (Page 11 of 66)

Assembleon Opal nozzle repair

Electronics Forum | Mon Aug 24 07:52:23 EDT 2015 | roblackey

Can Assembleon Opal nozzles be repaired? I have > a few ith chips on the corners of the tips. It > appears as though the tips are pinned in the > bodies of the nozzles, and that they could be > changed out. Thanks > Can Assembleon Opal nozzl

Thicker MBB Bag Punchure

Electronics Forum | Thu Feb 28 20:14:07 EST 2019 | rronaldreegan11

I have obervation that after migrate into thicker MBB bag, customer having mbb punchure at corner edge issue when shipping box is damaged at corner. There is no change of forwader or customer. Only different is thicker MBB with diffrent setting of va

Damaged PCB.. what do you think?

Electronics Forum | Fri Mar 16 10:04:41 EDT 2012 | davef

We'd repair a drop board like this. Here's what our old friend Jeff Ferry said is a published article ... When boards lose their edge: when the corner of a circuit board breaks or is damaged, the problem cannot be ignored by Jeff Ferry One of the m

Re: Misalignment Issue (CAD Vs. Machine Variables

Electronics Forum | Sun Nov 12 10:41:41 EST 2000 | JAX

Does the alignment issue only pop up on certain parts or everything on the board? Do you set your origin on the corner of the board or on a fiducial? Do you always have to move the parts the same amount of distance?

Re: BGA rework

Electronics Forum | Wed Nov 01 08:02:16 EST 2000 | Wolfgang Busko

Massimo: Do you encounter or see warpage of the device or the PCB, I think I remember that there was a thread about this topic of shorts of the corner pins of BGA. You might try the archive. Wolfgang

Re: BGA rework

Electronics Forum | Wed Nov 01 18:20:29 EST 2000 | massimo

Thank you Wolfgang, I've found something usefull in the thread, even if unfortunately nobody talks about the design of the nozzle. About the warpage, I clearly see the warpage of the corners of the BGA. To avoid it I'll keep the temperture of the nit


Electronics Forum | Tue Apr 24 12:05:56 EDT 2001 | pteerink

Robert, Were your parts in a sealed bag before use or were they exposed to the environment? If the parts have absorbed moisture, you might be seeing "popcorning" Phil


Electronics Forum | Thu Apr 26 09:29:43 EDT 2001 | Phil Bourgelais

Are you also getting shorts further into the package? Or is the failure simply the appearance of the package? If you send me the profile, I'd be happy to offer some suggestions. I have seen something similar. pbourgelais@us.vitronics-soltec.com


Electronics Forum | Mon Apr 30 09:20:50 EDT 2001 | Steve Zanola

We have seen the same thing. Our vendor recently change the way the BGA is fabricated and the new package warps. We are currently trying to adjust our process paramentes to fix this problem. I will try the "bake out" suggestion and see if it cor


Electronics Forum | Thu May 17 22:57:43 EDT 2001 | davef

It is amusing. Tell us about the profile, how you shot the vid, was the component "bug up" or "bug down", causes of the bridging, etc

corners searches for Companies, Equipment, Machines, Suppliers & Information