Electronics Forum: packing (Page 11 of 46)

Cover tape tearing

Electronics Forum | Fri Dec 16 10:25:14 EST 2005 | GS

Hi Liza - polystirene monolayer (blend ?) could be sealed at less presure, ie 35-40 PSI. Temprature could be 165�-170�C. For sure after sealed you shoud make sure the sealing strength (peel strength)should meet min 15-25 N.(bet avg from 25 to 45 N)

Siemens waffle pack Changer problems _ Help Please!!

Electronics Forum | Sat Feb 09 09:39:11 EST 2008 | stockley

You have my sympathy, the Line computer Station configuration screen is hard to get your head around. Assuming that you have configured the station correctly you might need to re-compile the station and/or consistency check it to see of it passes.

J-STD-033B.1

Electronics Forum | Thu Apr 01 03:44:31 EDT 2010 | nico67640

Good Morning Nicolas, > > Per J-STD-033B, 5.3.3.2 > states that a Dry cabintet maintained at not > greater than 5% RH may be considered MBB > storage. > > Hope this helps > > Chris Thanks Chris for your answer. I'm ok with you about the per

PCB over shelf life

Electronics Forum | Fri Dec 17 00:55:22 EST 2010 | kemasta

Hi Kim Dun take any risk in delamination bcoz u > will be the person to answer for being it. So, > we do bake all Pcbs, which have 3months of shelf > life, b4 startin any process although they are > still inside the factory packs. We keep it in

Solder beading with PCB from different fab

Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid

TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s

Die Crack Monitoring (DCM)

Electronics Forum | Mon Sep 19 19:22:11 EDT 2011 | henrytcx89

Thanks for taking ur time to answer this. =) The pick and place machine is just pick from wafer(on tape) and place into waffle pack. I read from some of the sources saying that the ejecting needle and the vacuum pick up bits could cause the die to c

Question on J-STD-001B

Electronics Forum | Mon Mar 13 08:59:20 EST 2000 | Ashok Dhawan

I could not find a specific clause or section in J-STD-001B which can relates to special requirements in storage, packing and handling of Moisture sensitive devices per J-Std-033 / 786A /-022 . I guess the way ESD is relevant to electronics assemb

Re: Fuji FGL manual needed

Electronics Forum | Fri Sep 15 08:15:49 EDT 2000 | csullivan

I am running a FGL1. Syringes can be bought from Fuji. One thing you should be aware of, the FGL1 needs the glue to be hand packed (from bulk) and spun in a centerfudge. The glue is hard to find bulk. Geez I thought we had the only FGL1. Email m

Stacking of Bare Boards

Electronics Forum | Fri Apr 07 10:26:01 EDT 2000 | Ashok Dhawan

I have come across a number of cases where Solder Mask is chipped off or scratched. I was wondering this has anything to do with : **Packing of PCBs in stacks and vacuum sealed **Stacking of PCBs prior to print operation What is general practice i

Question on J-STD-001B

Electronics Forum | Mon Mar 13 08:59:20 EST 2000 | Ashok Dhawan

I could not find a specific clause or section in J-STD-001B which can relates to special requirements in storage, packing and handling of Moisture sensitive devices per J-Std-033 / 786A /-022 . I guess the way ESD is relevant to electronics assemb


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