Electronics Forum: pass (Page 11 of 142)

Paste In Hole

Electronics Forum | Thu Jun 28 10:58:28 EDT 2001 | brownsj

The question is are you talking of a reflow or wavesolder process. If your talking reflow I used to use a stepped stencil to ensure I had sufficient paste and then make a double pass with my squeegees. First pass with a 45 degree rubber squeegee to f

Re: Double sided parts stuffing

Electronics Forum | Thu Nov 18 09:34:58 EST 1999 | Wolfgang Busko

Hi Will, it�s possible to use second reflow for second side components without glueing or use of different alloy solders. Although the first soldered joints become liquid during the second pass the parts will not fall off as long as their weight does

Re: PLCC's on IP3

Electronics Forum | Thu Apr 22 09:09:10 EDT 1999 | Scotty

Recently, we have been having problems with PLCC's passing vision on our IP's If the part is set up to be placed on Head 2, it will not always pass vision. However, if we move it over to Head 1, it will pass and place just fine. Now, I do realiz

manual stencil print 2 passes

Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef

We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with

smt fall-out -- acceptable rates

Electronics Forum | Wed Jul 14 15:36:34 EDT 2010 | remullis

98% to 99% pass yield should be your target. The previous company I worked for, we were able to meet these goals with most all of our products. It took us some years to achieve this level of pass rate. Of course analyzing and good reporting from some

Sad news about Werner Engelmaier

Electronics Forum | Sun Apr 17 12:19:50 EDT 2011 | stevezeva

Jack Crawford from the IPC, received the following message from Peter, Werner's son this morning: This is Peter, Werner's son. It is with great sadness, I am letting you know my father passed away on 4/15/2011. He was known as "Mr. Reliability" in

Connector is falling down in the second reflow

Electronics Forum | Tue Feb 11 10:51:20 EST 2020 | slthomas

To predict whether or not a first pass part is going to come off during the second pass you need to calculate the ratio of weight/soldered surface area. According to a couple of different sources that I've dug up, maximum is around 44 grams/in.^2. I

Contamination test

Electronics Forum | Sun Jul 29 21:33:30 EDT 2001 | CAL

Your Ionograph and Zero-ion Values are set by you. There is no raw pass of fail criteria only the limits you set up. Ionograph is great for bare board resistivity (salt) test just as a pass fail for incoming inspection but this is all per your facto

Re: Double Reflow

Electronics Forum | Tue Dec 28 15:35:21 EST 1999 | Mike Naddra

Edmund, An 0603 component should not fall from the board durring an inverted reflow pass, provided that: Your land geometries are correct for the package type (Start with SM 782 guidlines)- as surface tension of the liquidous solder is what holds

Re: Double sided reflow in one pass?

Electronics Forum | Fri Aug 20 10:44:40 EDT 1999 | k.t

Is there process by which one can do a double sided reflow (SMT on both sides) in one pass through the oven? Probably not. I have heard people talk of it but never see it done and I wouldn't recommend it. Good luck Yes, it is d


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