Electronics Forum | Fri Nov 02 12:49:33 EDT 2018 | robl
Has anyone tried producing domed joints for high voltage corona reduction on a selective solder machine? I'm guessing it probably won't work due to gravity, but worth a shout. Thanks, Rob.
Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph
Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they
Electronics Forum | Fri Sep 30 10:07:44 EDT 2005 | davef
Alternate explanations are: * Your reflow profile needs to be tweeked. * Bumps under a die look different than elsewhere on the package. Severe creases may indicate a problem, but creases of only a 0.001 to 0.002" deep should not pose any difficulti
Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy
1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3
Electronics Forum | Thu Jun 09 10:55:37 EDT 2005 | patrickbruneel
Hi Joseph, It's difficult to troubleshoot if the defect is unknown, but I agree with Chris The majority of components are already lead-free and only 17% of the worldwide electronics industry switched to lead-free wave and/or paste so the majority o
Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
Electronics Forum | Sun Mar 07 17:53:39 EST 2004 | Ken
Increasing the metals loading may help. But may cause issues elsewhere. Unsure of your exact process....but may work. Is anyone dispensing solder paste onto BGA pads...how is voiding in comparison???
Electronics Forum | Sun Mar 07 19:53:38 EST 2004 | praveen
Hello, Voids in BGA can not be eliminated. You can only minimize them by reducing the solder paste volume. Try to bake the plastic BGA's and PCB both as per the standard. Check the PCB at the BGA locations if the via's are masked.Masked via's result
Electronics Forum | Tue Mar 09 17:52:05 EST 2004 | davef
Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BGA balls. * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temp
Electronics Forum | Wed Apr 27 04:16:54 EDT 2005 | Bryan
Hello everyone, During our PIH process we found much flux residual around or on the joints of PIH after reflow.We use the Indium smq92j no clean solder paste.but the residual is too much to be accepted.can anybody share with me some ideas to solve th