Electronics Forum | Tue Jun 04 14:14:42 EDT 2002 | ckd
I meant to include this in the original message. One, the solder balls are on the circuit side of PCB. Two, some of the vias on both top and bottom are closed and some are not. Is this a process problem with the board house(s)?
Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer
Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...
Electronics Forum | Fri Dec 06 18:13:15 EST 2002 | slthomas
We only have solder balling problems in the interface of the pcb with the selective soldering pallet. All other boards (single, and double sided glue and waved alike) are fine, so I'm not thinking this is going to follow the normal path for resoluti
Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She
Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan
Electronics Forum | Wed Sep 15 22:52:58 EDT 2004 | pdeuel
We had same problem. Solder balls appeared on top side of board and led to damaged second side stencles. We worked around problem by running blank boards thru oven and inspecting and removing solder before processing boards with parts.