Electronics Forum: thermal pad (Page 11 of 49)

Defect reduction on RF design

Electronics Forum | Mon Sep 19 09:02:10 EDT 2005 | clampron

Good Morning Everyone, We have a customer that produces RF based assemblies. We are building several board types for them, all of which have an "RF" area of the PCB. This RF area does not have any mask to define pads. There are also several issues w

QFN void issue

Electronics Forum | Fri Jun 20 03:47:24 EDT 2008 | philip

Hi all, any good recommendation for PbF paste application to reduce voids underneath the QFN thermal pad (stencil thickenss? opening? via hole? reflow profile etc)? We have tried few stencil opening design but no significant improvement as seen. Ther

Tombstone components issue after reflow?

Electronics Forum | Sat Aug 12 02:52:16 EDT 2017 | tsvetan

There is no solution in above case, this is caused by the PCB design. There are no thermals on the pads connected to the copper poured area. So the other pad reflow first and lift the component.

Wave Soldering Upflow

Electronics Forum | Tue Aug 05 17:19:55 EDT 2003 | csimfgeng

Another variable is whether the ground pads have proper thermal reliefs. If the pad has solid ground plane around the perimeter, the heat being applied will quickly dissipate to the surrounding metal. A proper relief of the pad will prevent the hea

QFNs (LCCs)

Electronics Forum | Fri Dec 22 08:25:18 EST 2006 | aj

Hi, We had issues withthese parts when we first ran them thru our process. As the other lads have said - reduce thermal pad by 35-40%. ( we achieve this by using a dot matrix) . We also offset the lead apertures by 3thou ( i.e sort of overprinting)

QFNs (LCCs)

Electronics Forum | Wed Dec 27 08:11:46 EST 2006 | billyd

Thanks dude. It's a bit tough, but I guess so long as it's well thought out, it's like anything else. I shoot for a 60% coverage, pre reflow, with the vias either filled with epoxy, or capped with mask, at least if the plan is to use the thermal pad

Anyone facing QFN package crack problem ?

Electronics Forum | Fri Nov 30 19:39:51 EST 2007 | mika

Hi chs, What type of QFN or MLF package are we talking about? Assuming there is a middle thermal pad? Body Size & no. of terminals & pitch? What about your statement: "This package is so sensitive to any external force". Can you please explain what y

Best way to ensure max solder load on SOIC w Thermal Pad

Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef

The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p

Chip Components with big ground pads - Unsolder

Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef

Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature

What caused this reflow issue?

Electronics Forum | Tue Apr 15 21:24:41 EDT 2008 | davef

We find it curious that: * Heat slug pad for Q19 didn't take solder, indicating a pad [board] solderability issue. * Signal termination pads for Q19 didn't flow well, indicating a poor thermal recipe or a pad [board] solderability issue. * Signal ter


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