Electronics Forum | Fri Nov 12 16:59:58 EST 1999 | John Thorup
Hi Michael While driving home last night I realized the omission in my response. I thought someone would call me on it. I should have clarified that the dissolution of the gold into the joint would be affected by the thickness of the gold plating,
Electronics Forum | Fri Oct 08 17:03:03 EDT 1999 | Dave F
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Thu Sep 30 09:18:30 EDT 1999 | Chris May
Guys & Gals, I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc; I started with a simple form.....too simple, but now I think I've p
Electronics Forum | Mon Sep 20 14:06:02 EDT 1999 | Claude Couture
| Can anyone help with programming a D^2 Pak on a Panasert MV100. I'm having trouble setting up the parts data and teach the component. What should the Up, Down, Left, Right, Component Code, Lead Details, and Cut Lead Settings be? | A link to the pac
Electronics Forum | Wed Sep 22 21:07:00 EDT 1999 | JAX
| Can anyone help with programming a D^2 Pak on a Panasert MV100. I'm having trouble setting up the parts data and teach the component. What should the Up, Down, Left, Right, Component Code, Lead Details, and Cut Lead Settings be? | A link to the pac
Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F
| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that
Electronics Forum | Thu Aug 05 08:39:26 EDT 1999 | Wayne Sanita
| | | Hello, If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but after c
Electronics Forum | Tue Jul 27 11:59:19 EDT 1999 | Wolfgang Busko
While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would m
Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien
| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca
Electronics Forum | Mon May 24 10:17:54 EDT 1999 | john thorup
| Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the board
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