Electronics Forum: stencil (Page 110 of 540)

Stencil choice

Electronics Forum | Sun Aug 10 21:52:45 EDT 2014 | cmchoue

Thanks

stencil/printing machines for solder paste

Electronics Forum | Wed Feb 11 13:37:37 EST 2015 | cyber_wolf

I can buy approx 1000 stencils (cost includes next day delivery) for the price of a MY500. With a stencil, I can use WS paste and any other paste for that matter. The MY500 only jets certain paste from specific manufacturers. It is VERY VERY rare th

Alpha tetra bond stencils vs Vigon SC200

Electronics Forum | Fri Apr 10 12:23:27 EDT 2015 | utosun

The recommended wash concentration for stencil cleaning with VIGON SC200 is 25% and this should be confirmed using the ZESTRON BA-20 bath analysis kit. Additional cleaning recommendations are: Wash temperature should be approximately 25 degrees C. /

Homebrew Stencil Printer Vision, Completed

Electronics Forum | ttheis |

Thu Jan 28 16:45:21 EST 2016

Homebrew Stencil Printer Vision, Completed

Electronics Forum | ttheis |

Wed Feb 03 15:40:08 EST 2016

Homebrew Stencil Printer Vision, Completed

Electronics Forum | ttheis |

Tue Mar 01 21:24:37 EST 2016

IPA versus Stencil Cleaning Solution

Electronics Forum | Tue Jun 13 15:03:54 EDT 2017 | mmjm_1099

For many moons, I have used IPA for our cleaning tanks within out DEK systems. Now we have a new engineering team and he would like to try a stencil cleaning solution (DEK PRO XF). Can everyone tell me there pros and cons of using each of these over

SMT Stencil Design

Electronics Forum | Tue Mar 06 03:58:19 EST 2018 | ameenullakhan

Thanks.,

Stencil-less printing?

Electronics Forum | Wed Feb 28 08:14:39 EST 2018 | dontfeedphils

MY500 on a NPI/Proto line makes a lot of sense and can really cut down on costs and downtime due to stencil revisions/issues. Especially once you have a 250 line BOM loaded on the line and you find out the stencil has a couple of critical apertures

Solder balls defects

Electronics Forum | Tue Aug 14 13:54:57 EDT 2018 | etmpalletguy

Vlad, Reduce your aperture opening in the stencil, this will give the stencil a good seal around the specific area of concern. In a wave solder environment, solder balling top or bottom surfaces in a wave pallet is caused by excessive flux burning o


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