Electronics Forum | Fri Apr 13 05:59:58 EDT 2001 | zam_bri
I�ve just had an argument with my Boss on the frequency of Stencil cleaning. He told me to remove the procedures that asking the operator to send the Stencil for cleaning ( using Automatic machine ) after every 8 hours. I said big NO!! NO!!. He said
Electronics Forum | Mon May 28 04:29:16 EDT 2001 | hello
we met the same problem with audit, and i make a tooling log for each stencil and in tooling log , set up some criteria for checking such as tension , mechanical damage, printing result ect. The stencil will be checked periodicly by process engineer,
Electronics Forum | Tue May 29 16:52:07 EDT 2001 | hussman
By far the easiest way is to track solder paste measurement on your board - or solder defects after reflow (key word- easiest). Why spend 2 weeks examining a stencil when it clearly doesn't make defects, or IS making defects. I find using 2-D data
Electronics Forum | Tue Jul 10 13:45:23 EDT 2001 | markhoch
We're stencil printing a Loctite 3614 Chipbonder adhesive, and we're using BioAct SC-10 presaturated wipes to clean the stencil after printing, without much luck. Operators are not able to remove all adhesive material left in the aperatures, and aft
Electronics Forum | Fri Aug 03 16:46:59 EDT 2001 | davef
It's OK to have a thin film or haze of paste left on the stencil. Printing nice bricks of paste is the important thing. Assuming you know these things, so tell us more about your situation. PRINT QUALITY: What do your paste deposits look like?
Electronics Forum | Fri Jan 14 08:09:20 EST 2000 | Wolfgang Busko
We are using frameless stencils with a frame system tensioning in X- and Y-direction. After first quarrels with our stencilhouse about the correct position of the tensioning holes ( they needed 4 tries to get it right) there are no problems any more.
Electronics Forum | Fri Dec 17 18:21:43 EST 1999 | Clarissa L. Ortner
We are a small start up. We will be buying a stenciling machine and semi automated pick and place. ( We have the oven) We are presently stenciling without any assit and loading leadless parts only(no fine pitch) by hand. We need to improve thrupu
Electronics Forum | Fri Oct 22 21:23:59 EDT 1999 | se
Tombstoning is usually oven profiling, see October 14 thread below. Aperture rules are misleading. Component mix, stencil thickness, paste factors, all contribute. Also, are you making the stencil from a paste or pad layer or from a soldermask layer?
Electronics Forum | Wed Oct 13 23:57:55 EDT 1999 | se
As a stencil vendor to some assembly houses and small in-house assembly shops, both without CAD people rushing to put the paste layers (if they even generate one) into stencil friendly format, the silk screen is the only communication tool we have to
Electronics Forum | Tue Sep 21 04:00:27 EDT 1999 | Wolfgang Busko
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | We use 6 mil lasercut stencils with 15% reduction and th
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