Electronics Forum | Mon Sep 28 13:03:43 EDT 2015 | dyoungquist
The melting point of the solder itself does not change when you have underfill. If the underfill conducts heat better than air, it will take less heat (and/or less time) from your rework station to get the solder up to the melting point. That makes
Electronics Forum | Thu Sep 21 08:29:57 EDT 2000 | Dave F
Is this underfill reworability an issue with the underfill material or you rework machine?
Electronics Forum | Fri Aug 20 09:02:09 EDT 1999 | Frank
Hello, does anyone knowwhere I can get an underfill stoage cabinet with first-in-first-out system
Electronics Forum | Wed Feb 22 10:02:08 EST 2006 | Aaj
Hi! Why positive displacement technique cannot be used for underfill dispensing? Which is the best technique to dispense underfill?
Electronics Forum | Mon Jun 05 14:04:36 EDT 2006 | Brian
Check with the adhesive manufacturer. Not all underfill material is reworkable. Brian
Electronics Forum | Mon Jan 21 11:37:35 EST 2008 | rayjr1491
Is there a tool to check for voiding in a Underfill process?
Electronics Forum | Thu May 01 07:36:14 EDT 2008 | realchunks
Does the customer understand why underfill is used? I don't think you will gain anything on this QFN.
Electronics Forum | Fri May 02 13:30:03 EDT 2008 | ck_the_flip
Betcha this is coming from someone who "read" a magazine article on how underfill is so great.
Electronics Forum | Fri Sep 25 08:34:39 EDT 2020 | SMTA-64386317
Supplier would like to know the appropriate ball height to ensure suit to SMT and underfill process. Undefill using epoxy.
Electronics Forum | Fri Sep 25 10:02:12 EDT 2020 | SMTA-64386317
Yes, underfill process with dispensing. Customer require component must withstand certain strength.
