Electronics Forum | Wed Aug 07 01:41:27 EDT 2019 | orbitcoms
Hi I am having trouble getting solder bridges on TQFP-100 (0.5mm pitch) components. The boards are pasted on semi-auto printer using laser-cut 0.12mm stencil and SN63 NC257-2 T4 paste. The components are placed using Samsung CP40LV and tghen reflow
Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw
From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce
Electronics Forum | Wed Jun 11 12:03:29 EDT 2003 | rmurtuza
I have the speed data set at 0.12S for the small caps and in addition to that I am using an overall tact time reduction of 14 to 16 seconds. If I use the default overall tact time then I have placement defects such as components being placed: 1. Twi
Electronics Forum | Wed Apr 29 17:51:44 EDT 2009 | smt_guy
One more thing: I have a Panelized PCB with 8 boards on the X directions. As I move to the next PCB towards the right my misalignment moves to the right by 0.02mm. By the time I reach the 8th PCB I'm Off by between 0.12mm to 0.14mm. My fine pitch
Electronics Forum | Wed May 22 12:00:13 EDT 2019 | gregoireg
Thanks. It starts to make sense. There is a formula at the bottom of this page: http://www.circuitinsight.com/programs/50456.html It says: Stencil Thickness = 2.64mil + 0.0831 * pitch of component in mil. for 1.13mm, that gives exactly 0.16mm. So,
Electronics Forum | Fri Sep 08 01:08:10 EDT 2017 | tsvetan
The material is 0.12mm stainless steel, electropolished it's thick for fine pitch but we have lot of other big components on the board which do not solder good if we use 0.1mm thickness stencil. The 0.3 mm apretures are big enough and have good rele
Electronics Forum | Thu Jun 20 23:28:15 EDT 2019 | SMTA-David
How can I upload image to this forum? I can show you the pad layout. I am thinking maybe too much solder. I used 0.16mm thick stencil but notice many us 0.12mm thickness. Also, cream layer is 100% of pad surface, I know for fine pitch parts it is r
Electronics Forum | Tue Sep 05 10:43:02 EDT 2023 | klauss
I've some special nozzles for melf packaged diodes. When I am trying to mount it on pcb, nozzle picks up the diode and place it well. After 5-6 times of placing, diodes keep drops down to it's package from nozzle. It's like the vacuum doesn't enough
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
