Electronics Forum | Thu Jul 02 10:52:45 EDT 2009 | dyoungquist
For 0402s we use type 3 paste. We have .006 and .005 stencils. The .006 works okay but .005 seems to give us slightly better results. We use a 1:1 ratio for the aperture to match the pad, round pad not needed. With accurate placement and a correc
Electronics Forum | Tue Jan 24 20:00:39 EST 2012 | kahrpr
If you failed math like I did. A 0.005 inch stencil would work fine for those parts. Most stencils are 0.004in for fine pitch 1005s 201s. 0.005in is probably the most common generic stencil. 0.006in generally is if you need extra solder for big parts
Electronics Forum | Sat Nov 18 21:20:58 EST 2006 | Fer
Dave, May I ask where did you find the 1.5%, or the goal of .005" (or .007") per inch? The IPC-A-600 bow and twist standard calls for a .75% based on the calculation of the test method TM-650, method 2.4.22, which calculates the percentage based on
Electronics Forum | Fri Jul 14 16:32:55 EDT 2023 | calebcsmt
Does class 2 vs class 3 PCBs effect variance/tolerance in terms of actual positioning of pads/traces? For example, if fiducial is to be at 10mm. What's the tolerance for class 2 vs class 3? [variance allowed] Does panelization have any effect on t
Electronics Forum | Mon Apr 06 10:32:53 EDT 1998 | Justin Medernach
| Peter, | Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. | Whatever, they do reference one another. | | Question: Whatparameters are used to determine "good" Solder Paste? What refer
Electronics Forum | Tue Apr 27 16:49:16 EDT 2004 | davef
Where blank are the balls on a BGA supposed be? UNDERNEITH, dammit!!! Fire that inspector. It's good that you have your balls imbedded in something, so that they are not rolling around. Beyond that, consider the five ball system! - No more than
Electronics Forum | Mon Dec 27 13:34:28 EST 2010 | ppcbs
Does anyone have any experience in printing solder paste on a 0.0065" pad? I have a requirement to attach single chips with 600 to 2400 connections. The chip has a 0.005" solder ball, 0.010 pitch. Attaching to a substrate with a 0.0065" pad. An
Electronics Forum | Mon Nov 13 16:24:49 EST 2000 | Darby
Depending on the designers pad size, I generally go for 0.010" aperture with 0.010" spacing - stencil thickness 0.005". This combo with metal squeegees and the "usual suspects" of printer set up and placement details should you you hassle free.
Electronics Forum | Mon Sep 18 20:51:35 EDT 2000 | Dave F
A fairly dense brickwall would have 0.020" (0.05mm) spacing
Electronics Forum | Mon Jul 24 18:41:07 EDT 2000 | Darby
Sorry, scale division on that would be 0.05mm not 0.02mm. Magnification x24 or thereabouts. Also great for measuring all sort of things on pcbs, stencils etc to see if they come within spec.
