Electronics Forum | Tue Dec 01 12:12:07 EST 1998 | Mike
I am looking for a few PBGA 560 1.27 pitch Components. If anybody has any lying around I could buy. So that I may profile to my hearts content. Thanks Mike Cox
Electronics Forum | Tue Jun 18 00:53:09 EDT 2002 | Gang shen
we are surprised to find that ten BGA chips are excursion one line on the board,together the IP3 placed 600 BGA ,it really confused me.anyone have any suggestion for the reason? the BGA IS 20*20-16*16,pitch is 1.27.
Electronics Forum | Mon Jan 20 17:41:38 EST 2003 | James Springer; Advanced Technology Manager
Has anyone ever placed and reflowed a 1.27mm PBGA to 6 mil poly flex bonded to aluminum? If so what is the life expectancy of the solder joints?
Electronics Forum | Tue Apr 13 19:59:21 EDT 2004 | davef
Most 1.27 pitch BGA can be cleaned with modern machines. As far as the timing of cleaning OA flux res, obviously the sooner the better. After that different fluxes are different. This must be a common question for cleaning professionals. They pro
Electronics Forum | Tue Oct 04 06:52:28 EDT 2005 | Rob
Am I doing my maths right? 0.005 inches is 0.127mm which is crap for a stencil. Our supplier (laser cut)has an aperture tolerance of 0.005mm (approx. 0.000197 inches).
Electronics Forum | Wed Sep 30 15:28:49 EDT 2020 | spoiltforchoice
If you could change the design, a 2x25 1.27mm pitch surface mount connector is a standard part from Wurth. Samtec also do versions in any pin count you might desire, with locating pins, without, with picking clip etc.
Electronics Forum | Wed Jun 03 22:07:41 EDT 2009 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Mon Jan 23 22:53:31 EST 2012 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Wed Aug 04 16:09:48 EDT 2004 | Dreamsniper
Hi, Thanks for your reply. I run 2 boards, using the same paste, thermal profile and the same method of aqueous cleaning, 1st is a Topline test board with topline BGA (BGA 272 with 1.27 Pitch) and the 2nd is our product PCB with our BGA from Motoro
Electronics Forum | Fri Nov 04 13:00:24 EST 2005 | pjc
Some clarification: Max bottom side component is not 5mm as someone posted, its 12.7mm (0.5"). This is if you're going to have a Gel-Flex block under that component. Any component height at or over 12.7mm must not have a Gel-Flex block under it. Al
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