Electronics Forum: 130 (Page 2 of 19)

DI cleaner (washer) bath temperature

Electronics Forum | Tue Feb 27 10:19:06 EST 2007 | Michael Konrad

If you�re running chemistry in the wash, the wash temperature will be influenced by the chemical manufacturer�s recommendations. Typically, wash chemistries recommend operating temperatures between 130F and 150F. If your application is straight D

SMT chip component drop after DIP

Electronics Forum | Sun Oct 09 22:07:51 EDT 2016 | geniepro

I would like to ask after glue bonding is abalibity drop. I test by force equipment that it is very difficult to drop after reflow 2. Very due by DIP machine. I check after Dip many chip drop. I wonder the glue not qualify I am using IR 130. Could yo

Work in Process

Electronics Forum | Thu Feb 24 13:20:40 EST 2000 | Horace Johnson

What software package out there that can manage WIP. We are in the process of consolidating two of our SMT lines into three individual lines for equipment utilization. This will create lots of WIP and need a way to manage it. Any ideals

Re: BGA Inspection Criteria

Electronics Forum | Wed Dec 06 20:56:19 EST 2000 | Dave F

Why sure, we use WI-10-02-05, BGA Inspection Criteria, bgainsp.doc, 00, 9/15/99, based on an article in Evaluation Engineering Magazine, Sept �99, p130.

Gold coated spring contacts

Electronics Forum | Mon May 14 20:35:06 EDT 2001 | davef

You're correct. The units should be micro inches. By the by, this gold always should be a hard gold (99.96%-99.97% pure) with a Knoop hardness range of 130 to 200 (optimum 170).

Re: Suitable temperature for solderjoint ?

Electronics Forum | Tue Nov 16 11:02:46 EST 1999 | Dave F

Wolfgang: A snipet of information that maybe more on track that the previous babbling: The temperature limit for FR4 is 130�C according to UL746(?) Good luck Dave F

Multiple reflow cycles

Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob

I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.

Prob in Gold plated PCB prod

Electronics Forum | Sat Apr 10 11:47:16 EDT 2004 | mskler

Hi all, When we are producing A gold Plated PCB Then the Prob Of Dry soldering is coming Profile temps are 130, 150, 180,and 220 top & 215 bottom.Then what are the other causes or Precautions may be taken.

Stencil Organization/Storage

Electronics Forum | Wed Mar 23 05:07:47 EST 2005 | py (france)

Hi Bob we have more than 130 stencil we , also use racks than old 25 stencil the printer program has the same value than the stencil. for example see dek.com for racks.

01005 (0402 in metric unit) printing accuracy

Electronics Forum | Tue Jul 19 02:24:48 EDT 2005 | Vinit Verma

Assembleon A Series does it. Sony F-130 and Fuji XP143 both claim it possible on these machines. But I too wonder if there is a real need going down to 01005 from 0201 at least!


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