Industry News | 2019-04-23 07:36:42.0
SMTA announces registration is now open for the 2nd Annual eSMART Factory Conference on June 20-21, 2019 at the Dearborn Inn in Dearborn, MI, USA. Co-organized by Global SMT & Packaging magazine and SMTA, this conference brings together the key technologies shaping the electronics manufacturing industry including software systems and processes, augmented reality and alternative systems.
Industry News | 2024-01-29 01:52:21.0
In the ever-evolving landscape of Surface Mount Technology (SMT), the I.C.T-ISS2000 stands out as a game-changer in Intelligent SMD Tower. Crafted in Europe, this cutting-edge system adheres to the highest safety standards, making it a reliable choice for safety-conscious electronics manufacturers.
Industry News | 2003-01-27 09:31:04.0
The Conference Will Take Place March 22-27
Industry News | 2003-04-28 07:17:28.0
The conference took place March 22-27 in Long Beach, Calif., in conjunction with IPC Printed Circuits Expo� 2003
Industry News | 2015-02-25 19:36:56.0
IPC – Association Connecting Electronics Industries® bestowed its highest corporate honors to Plexus Corp. and Honeywell. During a luncheon at IPC APEX EXPO®, the IPC Stan Plzak Corporate Recognition Award was presented to Plexus Corp. and the IPC Peter Sarmanian Corporate Recognition Award to Honeywell.
Industry News | 2017-02-23 13:32:23.0
IPC – Association Connecting Electronics Industries® bestowed its highest corporate honors upon two member companies, Uyemura International Corp. and Honeywell. During a luncheon at IPC APEX EXPO® the IPC Peter Sarmanian Corporate Recognition Award was presented to Uyemura and the IPC Stan Plzak Corporate Recognition Award was presented to Honeywell.
Industry News | 2021-06-30 04:21:06.0
Takaya's APT-1600FD-SL Dual Sided Flying Probe test system for assembled PCBAs delivers both high speed and a larger testing area designed to accommodate large PCBAs for the emerging markets of 5G communications and BMS (Battery Management System) applications. The "-SL" series provides a 48% larger test area, which aligns perfectly with applications including semi conductor test probe card manufacturers. These customers urged Takaya to increase the test area of their dual-sided system.
Industry News | 2011-07-14 10:30:38.0
Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
Industry News | 2015-04-03 16:03:48.0
New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve test quality and yield of ICs for mobile applications.
Industry News | 2020-11-10 15:12:44.0
Inovaxe is pleased to announce that it will hold a webinar with a live presentation and demonstration on Thursday, Nov. 12, 2020 at 8:00 a.m. PT | 11:00 a.m. ET | 16:00 GMT
