Electronics Forum | Fri Aug 31 12:16:27 EDT 2007 | electronhose
Glastic is cheaper than the custom composite materials normally used for pallets, but the few I have had fabbed started to degrade pretty quickly. Some pallet material is rated at 260 C continuous / 360 Max where the best Glastic I could find is rate
Electronics Forum | Fri Dec 14 09:13:05 EST 2007 | lconnor
Hi Marcin, I have run a lead free profile on a VIP98 with Indium 5.1AT paste using the following settings:- 120 150 190 190 210 260 270 75cm/min Hope this helps. Lee.
Electronics Forum | Mon Oct 20 14:45:04 EDT 2008 | altonc
Does anyone know how to open this program without hardware key or any software can convert VIOS text to VIOS file for Philips X series
Electronics Forum | Mon Nov 01 04:40:29 EDT 2010 | jacki
Hi Mark thanks and useful. However, I couldn't find the Copper base solder paste which melting point is lower than 210'C.
Electronics Forum | Mon Nov 01 11:43:45 EDT 2010 | patrickbruneel
Jacki, Lead-free Cu based alloys with melting point below 210C don’t exist.
Electronics Forum | Fri Feb 04 16:07:38 EST 2011 | pjc
If your peak temps in profiling the Sn/Pb solderpaste are 210C-215C, then no, you will not "weld" to the SN100C finish. SN100C is liquidus at 227C, too hot for most Sn/Pb solderpastes.
Electronics Forum | Thu Jul 11 14:19:04 EDT 2013 | nicodj77
Hi, I'd google it and found these Maint. Manual for Fuji CP43 http://210.29.224.4/smt/newssb/fs/311.pdf Operation Manual for Fuji CP43 http://www.winsmt.com/down/006.pdf Hope it helps! Nick
Electronics Forum | Fri Sep 06 11:37:43 EDT 2013 | bobpan
I dont have a list for anything that old. The oldest i have is version 2.10. Check to see if the mod code list that you have says what version it is.....usually its on the top of the document
Electronics Forum | Sat Jun 01 04:39:14 EDT 2019 | gregoryyork
Consider a lower temp alloy(must contain silver) reflow around 210C for second side or dab a small dot of peelable resist next to component to stop movement
Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
