Electronics Forum: 2222 (Page 2 of 6)

Fudical, where, size, etc

Electronics Forum | Wed Nov 02 20:27:08 EST 2005 | davef

Why stop at fids: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards

V-scoring design and equipment questions

Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef

IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"

The minimal distance btw component and the edge of pcb

Electronics Forum | Sun Oct 09 16:57:30 EDT 2016 | davef

IPC 2222A Sectional Design Standard for Rigid Organic Printed Boards, 5.3 Design Requirements for Printed Board Assembly

minimal distance between THT solder padsfor selective soldering

Electronics Forum | Wed Apr 18 15:10:10 EDT 2018 | charliedci

If someone can find a RoHS specific standard I would be interested. IPC-2221 nor 2222 separate leaded from lead free (that I could see). Charlie

Scored Panel Depth

Electronics Forum | Mon May 21 17:37:51 EDT 2001 | davef

IPC-2222, Sectional Design Standard For Printed Board For Organic Printed Boards talks to scoring parameters in para. 5.3.1. You can obtain the standard at: http:///www.ipc.org. and Document Center [http://www.document-center.com/home.cfm/sid=71285

Question of delamination in PCB

Electronics Forum | Sat May 09 09:00:54 EDT 2009 | davef

For more on using tin as a resist during bare board fabrication, read "2.5.6 Introduction To Tin And Tin/Lead Plating" here: http://books.google.com/books?id=etfNcpiR5ZUC&pg=PT570&lpg=PT570&dq=%22circuit+board%22+%22etch+resist%22+%22acid+sulfate%22&

We're gettin' the standard!

Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef

See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6

0402's Tombstoning

Electronics Forum | Thu Oct 14 11:28:38 EDT 1999 | Bryan

We recently started designing boards using 0402's. The geometry was built using IPC specs but our contract manufacturer is having a yield problem. Approx. 20% of the 0402's are tombstoning. He claims the pads should be closer together; .4 mm between

Re: 0402's Tombstoning

Electronics Forum | Thu Oct 14 23:10:20 EDT 1999 | Dennis O'Donnell

I once had similar problems. It went away when I switched to a different brand of solder paste. When I switched back to the previous brand of paste the problem came back. I don't know why but the solder paste brand made a difference. go to: www.

Re: Resistance of traces

Electronics Forum | Tue Sep 14 13:49:14 EDT 1999 | Earl Moon

| I am looking to find a formula to calculate the resistance of circuit traces based on width | The old MIL-STD-275 became IPC-STD-275 became IPC-2221/2222. Anyway, they had/have simple graphic representations converting AWG standards into equivalen


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